Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Array substrate and transfer method

A technology for array substrates and substrate substrates, which is applied in the manufacture of semiconductor devices, electrical components, semiconductor/solid-state devices, etc., can solve the problems that Micro LED cannot be repaired, ACF is prone to holes or tears, etc., so as to improve the transfer yield and transfer Speed, the effect of realizing electrical connection

Active Publication Date: 2022-01-25
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above problems, the present invention provides an array substrate and a transfer method. The array substrate can avoid the contact between the micro-devices that do not need to be transferred and the array substrate by providing the bonding bumps, thereby solving the problem of ACF bonding faced by ACF bonding. It is easy to have holes or tears, and it is impossible to repair the Micro LED

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Array substrate and transfer method
  • Array substrate and transfer method
  • Array substrate and transfer method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0027] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an array substrate and a transfer method. The array substrate is provided with a plurality of bonding bumps, and each of the bonding bumps is configured to at least hold a micro device on its surface, so that The held micro-device is electrically connected to the array substrate; the array substrate and the transfer method of the present invention enable the array substrate to contact the micro-device only through the bonding bumps, thereby avoiding the need for transfer of the micro-device The contact with the array substrate can further solve the problems faced by ACF bonding that the ACF is prone to holes or tears and cannot be repaired for Micro LEDs.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an array substrate and a transfer method. Background technique [0002] Compared with OLED displays, Micro LED displays have the advantages of high reliability, high color gamut, high brightness, high transparency, and high PPI. In addition, the packaging requirements of Micro LED displays are low, and it is easier to achieve flexible and seamless splicing displays. Therefore, Micro LED display is a future display rate with great development potential in the future. [0003] figure 1 It is a process flow chart of the existing transfer method. like figure 1 As shown, in the existing transfer technology, the contact area between the Micro LED array device 20 and the ACF (Anisotropic Conductive Film) adhesive layer 11 of the array substrate 10 is large, making it difficult for the Micro LED 21 to be separated after selective transfer, and it is also easy to cause the ACF adhesi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/48H01L21/67H01L27/15
CPCH01L33/486H01L33/62H01L21/67144H01L27/156H01L2933/0033H01L2933/0066
Inventor 樊勇
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com