3results about How to "Fix the tear" patented technology

The present application relates to a kind of vertical battery frame mould pressing equipment and its mould pressing forming method, comprising: prepreg equipment, cantilever spreader, cutting and stacking equipment, grabbing manipulator and mould pressing host, mould pressing host includes: bearing base plate, linear guide, left mould pressing assembly, right mould pressing assembly, screw motor assembly, bottom plate for installing inner mould is arranged between left mould pressing assembly and right mould pressing assembly, inner mould is used to place the pre-press raw material to be formed, left mould pressing assembly and right mould pressing assembly are used to compress the pre-press raw material on the two sides of inner mould and form, upper mould assembly is arranged between left mould pressing assembly and right mould pressing assembly, upper mould assembly is used to compress the pre-press raw material on the upper end surface of inner mould and form, the side of inner mould close to screw motor assembly is provided with material pushing mechanism, the side of inner mould away from screw motor assembly is provided with frame body demoulding mechanism;The present application has the characteristics of short beat, high efficiency, less auxiliary equipment, less operator and low production cost.

The invention discloses an ultrathin back-drilled base plate and a preparation method thereof, and a circuit board and a processing method thereof, and the ultrathin back-drilled base plate comprises a structural layer, a first adhesive layer disposed on one side of the structural layer, and a second adhesive layer disposed on one side, opposite to the structural layer, of the first adhesive layer. Wherein the structural layer is made of a composite material containing a first high-heat-resistance polymer and a reinforcing filler; the material of the first adhesive layer comprises high-molecular resin, and the high-molecular resin contains at least one of a second high-heat-resistance polymer and a hot-melt adhesive, wherein the main chain of the second high-heat-resistance polymer contains an aromatic ring and / or a heterocyclic ring; and the material of the second adhesive layer comprises a hot melt adhesive. According to the invention, extremely high physical rigidity and chemical barrier capability can be maintained in circuit board hot pressing and wet processing processes, and the defects of back drilling hole flashing and orifice retreating are effectively inhibited; and the controlled interface stripping force is utilized in the plate stripping stage, so that the integral pure physical tearing of the base plate is realized, the secondary erosion of chemical film stripping liquid is avoided, and the residual glue on the surface of the base plate is eliminated.

The invention relates to the field of three-dimensional printing equipment, in particular to DLP three-dimensional printing equipment for customized product production. The 3D printer comprises a printing box, a lifting moving table, a DLP projector, a scraper assembly and a forming platform structure. A printing pool for containing liquid photosensitive resin is arranged at the upper end of the printing box; the lifting moving table is arranged on the mounting frame; the DLP projector is arranged on the lifting mobile station; the scraper assembly is located on the lifting moving table. The forming platform structure is arranged in the printing pool. The bending forming table is arranged, and the elastic body is prevented from being damaged in the stripping process through a flexible stripping mechanism for guiding the edge of a product to be curled. And meanwhile, the dynamic liquid supplementing system driven by the piston plate and the leveling and scraping system achieve the synergistic effect, an inherent stable environment is provided for high-precision printing, and the overall efficiency is improved in combination with modular operation.