Forming method and mold for flexible circuit board

A molding method and mold technology, applied in the directions of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem of uneven application of force at the joint of FPC reinforced area and non-reinforced area, and easy tearing of the joint between FPC and reinforcement. It can solve problems such as cracking and bad FPC, so as to solve the problems of easy crushing and tearing, avoid FPC tearing and crushing, and improve the yield.

Active Publication Date: 2019-12-27
融物宝国际融资租赁有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing FPC forming method is generally to punch and shape the full-page FPC that has been pasted with reinforcement. The force applied to the junction of the FPC reinforced area and the non-reinforced area is uneven, which causes the junction of the FPC and the reinforcement to be easily torn, resulting in poor FPC

Method used

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  • Forming method and mold for flexible circuit board
  • Forming method and mold for flexible circuit board
  • Forming method and mold for flexible circuit board

Examples

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Embodiment 1

[0058] This embodiment provides a method for punching an FPC substrate, and the FPC substrate includes such as image 3 Multiple FPC units arranged in the arrangement shown. Figure 4A It is a schematic diagram of the appearance structure of the FPC unit product with adhesive tape 50A and adhesive tape 50B in the reinforcement area 20A and reinforcement area 20B respectively before use, Figure 4B It is a schematic diagram of the external structure of the adhesive tape 50A and the adhesive tape 50B when it is used for the FPC unit product.

[0059] The punching method of the FPC substrate specifically includes:

[0060] S101, respectively, using a Figure 5A Dies of the shape shown and as Figure 5B The mold of the shown shape carries out die-cutting to described FPC substrate;

[0061] S201, attaching the FR-4 reinforcement board with adhesive tape 50A and the FR-4 reinforcement board with adhesive tape 50B on the reinforcement area 2A and the reinforcement area 2B respec...

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Abstract

The invention provides a flexible circuit board moulding method. The flexible circuit board moulding method comprises the following steps: providing an FPC substrate, wherein the FPC substrate comprises a plurality of FPC units, each FPC unit comprises an overall outer frame line, each FPC unit comprises a reinforcing zone and a non-reinforcing zone, and the overall outer frame line comprises a connecting outer frame line arranged along an outline of a junction of the reinforcing zone and the non-reinforcing zone, a reinforcing outer frame line arranged around only the reinforcing zone and connected with the connecting outer frame line, and a non-reinforcing outer frame line arranged around only the non-reinforcing zone and connected with the connecting outer frame line; punching the connecting outer frame line; arranging a reinforcing layer on the reinforcing zones of the plurality of FPC units; punching the reinforcing outer frame line and the non-reinforcing outer frame line. The invention further provides a mould for the flexible circuit board moulding method. Through the flexible circuit board moulding method and the mould, a defective FPC caused by easy tearing of the junctions of the reinforcing zones and the non-reinforcing zones of the FPC units can be avoided.

Description

technical field [0001] The invention relates to a flexible printed circuit board (Flexible Printed Circuit Board, FPC), in particular to a molding method and a mold for a flexible printed circuit board. Background technique [0002] The existing FPC forming method is generally to punch and shape the full-page FPC that has been pasted with reinforcement. The applied force at the junction of the FPC reinforced area and the non-reinforced area is not uniform, so that the junction of the FPC and the reinforcement is easily torn, resulting in a defective FPC. Contents of the invention [0003] Based on this, a molding method and a mold of a flexible circuit board are provided so that the FPC reinforced joint is not easily torn. [0004] The invention provides a molding method of FPC, comprising: [0005] S1, providing an FPC substrate, the FPC substrate includes a plurality of FPC units, each FPC unit is provided with an overall outline frame line, and each FPC unit is provid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K1/02
CPCH05K1/0281H05K3/0044H05K2201/2009H05K2203/0228
Inventor 邹飞李晓华
Owner 融物宝国际融资租赁有限公司
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