31results about How to "Performance optimization and improvement" patented technology

The invention provides a semiconductor device and a manufacturing method thereof, and the manufacturing method of the semiconductor device comprises: forming a trench filling structure in a substrateof a pixel region, and further clamping a high-K dielectric layer between the side wall of a filling material in the trench filling structure and the substrate; forming a plug structure in the substrate of the pad region; covering a buffer dielectric layer on the surface of the substrate in the pixel region and the bonding pad region; etching the buffer dielectric layer to form a first opening which at least exposes part of the substrate at the periphery of the top side wall of the trench filling structure and / or at least part of the top of the trench filling structure; and forming a metal grid layer on the buffer dielectric layer of the pixel region, and filling the first opening so as to be electrically connected with the exposed part of the substrate and / or the trench filling structure.According to the technical scheme of the invention, the metal grid layer is electrically connected with the exposed part of the substrate and / or the trench filling structure, so that the electrical performance of the semiconductor device can be optimized and improved.

The invention provides a semiconductor device and a manufacturing method thereof. The manufacturing method of the semiconductor device comprises the steps of forming a groove filling structure in a substrate of a pixel region, and clamping a high-K dielectric layer between a side wall of a filling material in the groove filling structure and a substrate; covering a buffer dielectric layer on a surface of the substrate in the pixel region; etching the buffer dielectric layer to form a first opening which at least exposes parts of the substrate at a periphery of a top side wall of the groove filling structure and / or at least parts of a top of the groove filling structure; filling a first conductive metal layer in the first opening so as to be electrically connected with the exposed parts ofthe substrate and / or the groove filling structure; and forming a metal grid layer on the buffer dielectric layer and electrically connecting the metal grid layer with the first conductive metal layer.In the technical scheme of the invention, the metal grid layer is electrically connected with the exposed parts of the substrate and / or the groove filling structure so that electrical performance ofthe semiconductor device can be optimized and improved.

The invention provides a cross-platform GUI touch event analysis method in a Unity environment, which solves the problem of integrating the event management to a management layer by using a single example class to carry out the entrusted event registration management and the touch analysis distribution. The multi-platform touch analysis inherits a unified interface, externally different cross-platforms are realized for the same interface, both a mobile terminal and a PC terminal are unified, and more memories are not occupied. A Unity basic class is used as a scheme implementation core, the performance optimization is better, a little expenditure exists during initialization, and no other extra expenditure exists during the process at ordinary times except for the normal analysis logic. The method can be applied to a mobile terminal platform and a PC terminal platform.

The invention discloses a conical building and a construction method thereof. The conical building comprises a radial beam, a central ring beam, a sunshade, a skylight frame and a steel structure keel, and the top of the radial beam is connected to the central ring beam and automatically The central ring beam is arranged radially to the surroundings. The bottom of the radial beam is connected to the steel structure joist, and the steel structure joist is connected to the foundation concrete structure. On the radial beams between the gaps of the sun visors, the sun visors are arc-shaped plates whose edges are bent toward the interior of the building, and the outer surface of the sun visors is arched outward. The prestressed structural beams of the string beams can maintain the stability of the building through structural expansion and contraction when the temperature changes and the structure vibrates, and the number of components is small, and the difficulty of on-site construction and installation is greatly reduced. promote.

A circuit board aging vehicle, which is composed of a frame, aging equipment, spring pins, and casters. bottom of the four corners of the rack.

The invention discloses a salient pole type offshore wind turbine parameter optimization method based on a high-temperature superconducting magnet exciting coil. A rotor of a motor is a salient pole; the magnet exciting coil adopts a high-temperature superconducting material; and the weight, loss and efficiency analysis of the motor are completed by setting of basic parameters of the motor, armature winding parameters, magnetic flux density, stator iron core parameters, wind turbine armature winding structure, high-temperature superconducting magnet exciting coil parameters, armature magnetic leakage and reverse magnetic potential under a load condition, three-dimensional magnetic field analysis and the like. According to the method, the salient pole type offshore wind turbine parameter optimization method can be carried out automatically according to computational formulas to realize optimization of the weight, the efficiency, the high-temperature superconducting material length and other parameters of the offshore wind turbine; and meanwhile, two closed loop feedback circuits of a magnetic field leakage inductance coefficient and a running current are included in the optimization process, so that the method plays a key role in improvement of the optimization of the motor performance.

The present application relates to a message forwarding method and device, a dual-active system and communication equipment, and belongs to the technical field of communication. The method includes: the first device determines that its own link aggregation group is faulty; the first device adds the Peer-Link port as a member port to the link aggregation group; When sending packets, the service packets are forwarded from the Peer-Link port based on the address entry before the failure. When the link aggregation group of the first device fails, the Peer-Link port is added to the link aggregation group as a member port, so that the address entry originally added to the link aggregation group of the first device is not changed. In this way, all the service traffic that needs to be forwarded through the link aggregation group is forwarded to the second device through the Peer-Link port for processing, so that the performance of service traffic fault recovery is optimized.

The invention discloses a rotational coordinate transformation based current decoupling control method for a three-phase grid-connected inverter. With regard to a grid-connected inverter with an LCL (Inductor Capacitor Inductor) filter, an inversion three-phase output current signal and a grid-side three-phase current signal are transformed into two groups of orthogonal current signals in a synchronous rotation coordinate system through adopting coordinate transformation, the two groups of orthogonal current signals are subjected to the calculation of weighted average to be used as an inverter current controlled feedback signal and an inverter current controlled decoupling signal under a rotational coordinate system, the feedback signal is compared with a control given signal to obtain an error signal, and the obtained error signal is subjected to proportional-integral regulation and then is subjected to a combined operation with the decoupling signal to obtain a pulse duty-ratio signal for controlling a three-phase inverter switch to operate under the rotational coordinate system, so that output current waveform and amplitude control of the grid-connected inverter can be realized. Through adopting the method disclosed by the invention, the signal coupling problem existing in three-phase current control of the LCL filter three-phase grid-connected inverter can be effectively solved, the capacity of independently controlling each phase of output current is enhanced, and the favorable output current waveform of a grid-connected system can be achieved.

The present invention provides a semiconductor device and a method for manufacturing the same. The method for manufacturing the semiconductor device includes: forming a trench filling structure in a substrate of a pixel region, and filling material in the trench filling structure with sidewalls and the substrate A high-K dielectric layer is also sandwiched therebetween; the buffer dielectric layer is covered on the substrate surface of the pixel region, and the buffer dielectric layer buries the trench filling structure; the buffer dielectric layer is etched to form at least the trench filling Part of the substrate and / or the trench at the periphery of the top sidewall of the structure fills at least part of the first opening at the top of the structure; and, forming a metal grid layer on the buffer dielectric layer and filling the first opening so as to be compatible with the exposed part The substrate and / or the trench filling structure are electrically connected. The technical solution of the present invention enables the metal grid layer to be electrically connected to the exposed part of the substrate and / or the trench filling structure, thereby enabling optimization and improvement of the electrical performance of the semiconductor device.

The invention provides a cross-platform GUI touch event analysis method in a Unity environment, which solves the problem of integrating the event management to a management layer by using a single example class to carry out the entrusted event registration management and the touch analysis distribution. The multi-platform touch analysis inherits a unified interface, different cross-platforms are realized for the same interface, both a mobile terminal and a PC terminal are unified, and more memories are not occupied. A Unity basic class is used as a scheme implementation core, the performance optimization is better, a little expenditure exists during initialization, and no other extra expenditure exists during the process at ordinary times except for the normal analysis logic. The method can be applied to a mobile terminal platform and a PC terminal platform.

The characters of the invention are as follows. The operating system files and the application program files stored in the memory are called and stored by using the dynamic embedded mode so as to generate the virtual operation system disc in the memory. The functions of the compatible computer meet the performances of the high end PC, providing the features of low cost, easy of use and maintenance, high efficiency, stability and reliability.

The invention provides a method for improving a titanium-aluminum laminated composite material structure and improving mechanical performance. Tungsten core SiC ceramic fibers are pre-treated, and NiTi alloy wires, Ti foil and Al foil are subjected to ultrasonic cleaning; the Ti foil, the tungsten core SiC ceramic fibers, the NiTi alloy wires and the Al foil serve as a unit to be stacked according to the sequence of the Ti foil, the tungsten core SiC ceramic fibers, the NiTi alloy wires, the Al foil and the Ti foil, the four SiC fibers are placed between every two NiTi alloy wires, the interval is 1 mm, and the upper surface and the lower surface are both the Ti layers; and sintering is conducted on the unit through a vacuum hot pressing device. According to the method for improving the titanium-aluminum laminated composite material structure and improving the mechanical performance, through the design principle that nickel and titanium elements in the NiTi wires easily react with aluminum elements under the low temperature to form inter-metallic compounds, the SiC fibers and the NiTi alloy wires are simultaneously introduced into inter-metallic compound layers through the vacuum hot pressing sintering method, the SiC fibers serve as reinforcing bodies, introduction of the NiTi alloy wires aims to remove inter-metallic compound layer center lines through the sufficient diffusion reaction mechanism of the NiTi alloy wires and Al, and the SiC fiber / base body interface is improved, so that the mechanical performance of a composite material is improved.

The invention discloses a method for making a novel side key product, comprising: making an FPC empty board, and printing silver paste, conductive carbon oil, and protective ink printed on the silver paste and carbon oil on the pad surface of the FPC empty board; Attach the thermosetting adhesive to the FPC empty board, use a round-head nail to position the special jig, and fix the jig on the desktop of the board; punch holes; place the conductive ink of the PFC empty board facing down, and The FPC empty board is punched; according to the size of the steel sheet, the suction head for the automatic reinforcement machine is customized, and the automatic reinforcement machine is used to make the FPC empty board fit the steel sheet, so as to obtain the FPC assembled and pasted with the steel sheet; One side of the above-mentioned FPC is turned over with the anti-folding line, so that the FPC wraps the steel sheet up and down; the FPC with the steel sheet reinforced is placed on the four-opening pressing machine for pressing, and the preset processing conditions are followed; after the steel sheet is pressed It is baked in a cabinet oven, and the product is covered with a release film during baking; after curing, it will be circulated according to the engineering design process, and finally the appearance of the finished product will be inspected by FQC / FQA, and the product will be packaged and shipped.