Composite solder and preparation method and application thereof

A technology of composite brazing material and brazing material, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of low strength of brazed joints, poor interface bonding force, complicated manufacturing process, etc., and achieve improved impact resistance and anti-corrosion Shear performance, slow release of thermal stress, effect of solving tearing

Active Publication Date: 2020-07-31
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of solder production method is difficult to be used in the preparation of brittle solder and complex shape solder
Moreover, although there are currently three layers of sandwich solder, there are many problems such as poor interface bonding force, low brazing joint strength, complicated manufacturing process, and high cost in the sandwich solder of the existing structure.

Method used

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  • Composite solder and preparation method and application thereof
  • Composite solder and preparation method and application thereof
  • Composite solder and preparation method and application thereof

Examples

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Effect test

preparation example Construction

[0065] In another aspect of the present invention, the present invention provides a kind of preparation method of above-mentioned composite solder, and this preparation method comprises:

[0066] A solder layer is formed on at least one surface of the stress buffer layer to obtain the composite solder; preferably, the solder layer is formed on two opposite surfaces of the stress buffer layer to obtain the composite solder . Therefore, the operation is simple and convenient, easy to realize, saves energy, and has high production efficiency.

[0067] In some embodiments of the present invention, the above preparation method includes: placing the solder layer on at least one surface of the stress buffer layer to obtain a composite layer; rolling the composite layer to obtain the composite solder . Therefore, the operation is simple and convenient, and it is easy to realize, the preparation process saves energy, and the production efficiency is high.

[0068] In some embodiment...

Embodiment 1

[0083] Composite solder preparation method comprises:

[0084] (1) Melt, cast, extrude, and roll the BCu93P solder alloy to a thickness of 0.2mm and a width of 5mm, and put it into a continuous punching machine to punch a hole in the center of the BCu93P copper-phosphorus solder strip. The diameter of the hole is 2mm , the distance between the centers of the holes is 4mm, and the burrs around the holes are removed by sanding;

[0085] (2) Select a pure tin strip with a thickness of 0.05mm and a width of 6mm, place the BCu93P solder alloy strip in the middle layer, place the pure tin strip on both sides of the BCu93P solder alloy strip, and send it into a closely matched rubber roller, The thickness of the rubber skin on the surface of the rubber roller is 5mm;

[0086] (3) The soft tin sheet deforms plastically into the hole of the hard copper-phosphorus alloy strip under the elastic action of the rubber, and the hardness of the copper-phosphorus alloy strip hole is relativel...

Embodiment 2

[0090] Composite solder preparation method comprises:

[0091] (1) Melt, cast, extrude, and roll the BCu93P solder alloy to a thickness of 0.2mm and a width of 5mm, and put it into a continuous punching machine to punch a hole in the center of the BCu93P copper-phosphorus solder strip. The diameter of the hole is 2mm , the distance between the centers of the holes is 4mm, and the burrs around the holes are removed by sanding;

[0092] (2) Select a pure tin strip with a thickness of 0.05mm and a width of 6mm, place the BCu93P solder alloy strip in the middle layer, place the pure tin strip on one side of the BCu93P solder alloy strip, and feed it into the strip by a rubber roller and a steel Among the rolls that closely match the quality rolls, the rolls that are in contact with the tin strips are rubber rolls, and the thickness of the rubber skin on the surface of the rubber rolls is 5mm;

[0093](3) The soft tin sheet deforms plastically into the hole of the hard copper-phos...

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Abstract

The invention provides a composite solder and a preparation method and application of the composite solder, and relates to the technical field of welding. The composite solder comprises a stress buffer layer and a solder layer, wherein a through hole is formed in the stress buffer layer, and the solder layer is arranged on at least one surface of the stress buffer layer. The through hole in the stress buffer layer of the composite solder can play a role of slowly releasing stress, so that the composite solder has good anti-shearing performance, bending resistance, stamping resistance and the like, and the preparation of a large-area complex-shape preformed solder is facilitated.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a composite solder and its preparation method and application. Background technique [0002] Brazing is one of the three main components of modern welding technology, widely used in the connection of metals, non-metals, ceramics, composite materials, etc. Brazing filler metal is one of the core factors to realize brazing filler metal connection and obtain high-quality welded joints. Traditional brazing filler metals are generally produced by the "casting-extrusion" process, that is, batching-smelting-extrusion-drawing-intermediate annealing-surface treatment-splitting and other processes are prepared into sheets or filaments. This kind of solder production method is difficult to be used in the preparation of brittle solder and solder with complicated shapes. Moreover, although there are three-layer sandwich solders at present, the sandwich solders with existing structures have...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/40
CPCB23K35/0255B23K35/40
Inventor 龙伟民董博文张雷秦建张亮吕登峰张丽霞李宇佳
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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