A kind of drilling positioning method of multilayer printed circuit board

Abstract

The invention provides a drilling positioning method for a multilayer printed circuit board, which includes: designing a first target hole pattern on the same position of the film used for exposure processing on each layer of the multilayer printed circuit board , the second target hole pattern and the third target hole pattern; the first positioning target hole, the second positioning target hole and the third positioning target hole are drilled on the multilayer printed circuit board after lamination; Drill the first backing plate hole, the second backing plate hole and the third backing plate hole; drill the first aluminum sheet hole, the second aluminum sheet hole and the third aluminum sheet hole on the aluminum sheet; place the backing plate, at least one more Layers of printed circuit boards and aluminum sheets are overlapped in sequence and fixed with glue to form a whole; put pins on the whole and fix it on the drilling rig; according to the position of the whole fixed on the pin seat Drill holes in the printed circuit board for positioning. The beneficial effects of the present invention may include: it can save the time of driving the pins; it can save the time of drilling the upper plate and the lower plate.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular to a drilling positioning method for multilayer printed circuit boards. Background technique [0002] At present, the drilling positioning of multi-layer printed circuit boards adopts pin positioning. First, the corresponding pin holes are drilled on the drilling rig with bakelite board and backing plate, and then according to the position of the pin holes on the machine and the multi-layer printed circuit board, the corresponding pin holes are drilled. After the circuit board is laminated, the positions of the target holes drilled with X-Ray are fixed on the drilling rig in one-to-one correspondence. This method mainly has the disadvantage that the upper and lower multi-layer printed circuit boards can only be operated one by one, which takes too long, and at the same time, the pins will be slightly Loose, many times will affect the processing quality of m...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the need to use bakelite for drilling positioning in the prior art, and only operate one by one when the upper multi-layer printed circuit board and the lower multi-layer printed circuit board, which takes too long and many times The upper and lower multilayer printed circuit boards cause the pins to be slightly loose, which in turn affects the lack of processing quality of the multilayer printed circuit boards

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