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Design for data center cooling capacity dispatching and management

A data center cooling and backup cooling technology, applied in cooling/ventilation/heating renovation, electrical equipment structural parts, electrical components, etc., can solve problems such as different workloads

Pending Publication Date: 2021-04-09
BAIDU USA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in actual deployment and operation, the workload may differ from the initial design

Method used

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  • Design for data center cooling capacity dispatching and management
  • Design for data center cooling capacity dispatching and management
  • Design for data center cooling capacity dispatching and management

Examples

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Embodiment Construction

[0015] Various embodiments and aspects of the disclosure will be described with reference to details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are examples of the present disclosure and should not be construed as limiting the present disclosure. Numerous specific details are described below in order to provide a thorough understanding of various embodiments of the present disclosure. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present disclosure.

[0016] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The appearances of the phrase "in one embodiment" in various places in the specification are not...

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Abstract

A dynamically adjustable cooling system is discussed and a system configuration design method is disclosed for cooling airflow management and dispatching. The system includes a first and second IT rooms that include electronic racks with IT components. The system also includes cooling units configured to provide cooling air to the IT components. The system also includes a cooling air supply channel to distribute the cooling air to the IT components. The system also includes multiple louvers installed at different locations such as on supply ports of the cooling units, within the cooling air supply channel, and on entrance ports to the IT rooms which are used for configuring the airflow within the supply channel. Each louver is capable of being opened and closed independently to create multiple different air flow combinations for cooling the IT components.

Description

technical field [0001] Embodiments of the invention generally relate to data centers. More specifically, embodiments of the invention relate to cooling electronics racks in data centers. Background technique [0002] Heat removal is a prominent factor in computer system and data center design. The number of high-performance electronic components, such as high-performance processors, packaged within servers has been steadily increasing, thereby increasing the amount of heat generated and dissipated during normal operation of the server. The reliability of servers used in data centers degrades as their ambient temperature rises or exceeds desired ranges. Maintaining a proper thermal environment is critical to the proper operation of these servers in the data center, as well as server performance and longevity. Heat removal solutions are necessary to cool these high performance servers and IT equipment. [0003] Power-intensive processors enable computationally intensive so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20727H05K7/20754H05K7/20745H05K7/2079H05K7/20145H05K7/20181H05K7/20836
Inventor 高天翼
Owner BAIDU USA LLC