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Manufacturing method of chip anti-counterfeiting intelligent package with detection function

A technology of intelligent packaging and production methods, which is applied to the recording carrier used by the machine, locking equipment, instruments, etc., and can solve the problem of products being packaged maliciously

Pending Publication Date: 2021-04-13
重庆五盾科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the above problems, the present invention provides a method for making an anti-counterfeit smart package with a detection function chip. Pain points, end users can also easily query, and enterprises can also improve the efficiency of intelligent management such as logistics, warehousing, inspection, and statistics in this way

Method used

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  • Manufacturing method of chip anti-counterfeiting intelligent package with detection function
  • Manufacturing method of chip anti-counterfeiting intelligent package with detection function
  • Manufacturing method of chip anti-counterfeiting intelligent package with detection function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as figure 1 , figure 2 , image 3 , Figure 4 As shown, a method for making an anti-counterfeiting smart package with a detection function chip, the package includes a package cover 10, a package body 20, a radio frequency antenna 50, a chip 60, a detection antenna 70, a cutting line 30, a tip hole 40, a tip body 80, tip sleeve 90; the packaging cover 10 and the packaging body 20 are composed of multi-layer composite materials, one end of the packaging body 20 is located inside the packaging cover 10, and the tip hole 40 runs through the packaging cover 10 and the packaging body 20, there is a tangent line 30 at an appropriate position around the outer diameter of the tip hole 40 on the packaging cover 10, and the chip 60 is connected to the radio frequency antenna 50 and the detection antenna 70 to form an electronic tag of a closed-loop conductive path, the electronic tag Built in the packaging cover 10 or the packaging body 20, the detection antenna 70 inter...

Embodiment 2

[0051] Such as Figure 5 As shown, a method for manufacturing an anti-counterfeit smart package with a detection chip, the three units of the chip 60, the detection antenna 70, and the radio frequency antenna 50 constitute an electronic label 100, and the working frequency band of the electronic label 100 is divided into Low frequency band (working frequency is 125KHZ\134KHZ), ISO11784, ISO14223 communication protocol, high frequency band (working frequency is 13.56MHZ), using ISO / IEC14443 or ISO / IEC15693 communication protocol, ultra-high frequency band (working frequency is 840MHZ-960MHZ), Using ISO / IEC18000-6 communication protocol, one of dual frequency bands (working frequency 840MHZ-960MHZ and 13.56MHZ) or microwave frequency band (working frequency 2.45GHZ-5.8GHZ); the electronic label 100 can be packaged The finished composite label can also be dry Inlay or wet Inlay (the so-called Inlay is a pre-laminated product composed of multi-layer PVC sheets containing chips and...

Embodiment 3

[0056] Such as image 3 , Figure 4 As shown, a method for making an anti-counterfeit smart package with a detection function chip, the shape of the package cover 10 and the package body 20 can be any geometric shape, and the shape is designed according to the properties of the packaged object, and its material is Non-metallic environmentally friendly composite materials.

[0057] Further, the packaging cover 10 and the packaging body 20 can be two independent units, and can also be a whole. The packaging cover 10 and the packaging body 20 can be connected to each other at one end during production, or they can be completely separated from each other. an independent body.

[0058] Furthermore, there is no restriction on the placement position of the electronic tag 100 in the packaging cover 10 or the packaging body 20, it is only necessary to ensure that the detection antenna 70 intersects with the knife cutting line 30, and the length of the detection line 70 is also make ...

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Abstract

The invention discloses a manufacturing method of a chip anti-counterfeiting intelligent package with a detection function. The package comprises a package cover, a package body, a radio frequency antenna, a chip, a detection antenna, a cutting line, a pin hole, a pin body and a pin sleeve; the package cover and the package body are made of multilayer composite materials, one end of the package body is located on the inner side of the package cover, the pin hole penetrates through the package cover and the package body, and the cutting line is arranged at the proper position around the outer diameter of the pin hole; the chip is connected with the radio frequency antenna and the detection antenna to form an electronic tag of a closed-loop conductive path, the electronic tag is arranged in the package cover or the package body, and the detection antenna intersects with the cutting line; the pin body extends to the surface of the package cover from the inner side of the package body through the pin hole and is connected with the pin sleeve, and when the package is opened along the cutting line, the detection antenna is broken; and if the chip is read by a mobile phone or special equipment, the current package is displayed to be in an opened state, and the state is never reversible once recorded.

Description

technical field [0001] The invention belongs to the field of anti-counterfeiting intelligent packaging for products, and specifically relates to a method for manufacturing anti-counterfeiting intelligent packaging with detection function chips. Background technique [0002] For a long time, there are many types of counterfeit and shoddy products on the market, and the imitation methods are becoming more and more sophisticated, and the imitation effect can also reach the point where the fake ones can be confused with the real ones, which not only brings harm to consumers, but also damages the economy, reputation, credibility, and brand of the company. It should not be underestimated. At the same time, for some high-value products, the phenomenon of product repackaging occurs under the premise that the packaging is intact. Therefore, most companies are eager to find a feasible way to prevent counterfeit and shoddy products from causing damage to themselves. At the same time, i...

Claims

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Application Information

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IPC IPC(8): B65D55/02G06K19/077G06Q30/00
CPCB65D55/02G06K19/07722G06K19/07726G06K19/07783G06Q30/0185
Inventor 王俊蘅
Owner 重庆五盾科技有限公司
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