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Manufacturing process for lightweight vapor chamber and vapor chamber

A manufacturing process and vapor chamber technology, which is applied in lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of increasing the material and weight of the vapor chamber, etc.

Pending Publication Date: 2021-04-13
宝德华南(深圳)热能系统有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the structural strength of the chamber, the prior art usually adopts the method of adding support columns in its cavity, but this method not only increases the weight of the chamber, but also increases the material used for the chamber.

Method used

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  • Manufacturing process for lightweight vapor chamber and vapor chamber
  • Manufacturing process for lightweight vapor chamber and vapor chamber
  • Manufacturing process for lightweight vapor chamber and vapor chamber

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Embodiment Construction

[0030] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only the technical solutions of the present invention. Some, but not all, embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a d...

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Abstract

The invention relates to the technical field of heat dissipation, and discloses a manufacturing process for a lightweight vapor chamber and the vapor chamber. The manufacturing process comprises: connecting a condensation layer to the side surface of a structural layer to obtain a composite strip; stamping the composite strip to obtain a bottom plate with a first sealing portion and a first heat conduction portion; stamping the composite strip to obtain a cover plate with a second sealing portion and a second heat conduction portion, forming a support portion on the second heat conduction portion, and enabling the support portion to abut against the second heat conduction portion or other parts of the vapor chamber; connecting a heat conduction member to the condensation layer of the cover plate; sealedly connecting the first sealing portion to the second sealing portion, forming a heat conduction cavity for containing the heat conduction member between the second heat conduction portion and the first heat conduction portion, and meanwhile, clamping the heat conduction member between the second heat conduction portion and the first heat conduction portion; injecting working liquid into the heat conduction cavity, and sealing the heat conduction cavity. The vapor chamber manufactured by the manufacturing process for the lightweight vapor chamber not only has enough structural strength, but also is light in weight.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a manufacturing process of a light-weight vapor chamber and the vapor chamber. Background technique [0002] With the intensive development of various electronic devices and equipment, such as the development of computer chips to high performance, miniaturization and miniaturization, whether the heat generated during work can be dissipated in a timely and effective manner has become a direct impact on electronic devices. One of the key factors of work performance and reliability. [0003] In order to improve the heat dissipation performance of electronic devices, vapor chambers have been widely used to dissipate heat from electronic devices. In order to improve the structural strength of the chamber, the prior art generally adopts the method of adding support columns in the chamber, but this method not only increases the weight of the chamber, but also increases the mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/046
Inventor 李金波刘哲洪鄢豪何志兴
Owner 宝德华南(深圳)热能系统有限公司
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