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3results about How to "Improve mechanical structure strength" patented technology

Double-fed wind generator grid connection and power direct vector control method

PendingCN121863576AImprove mechanical structure strengthGood dynamic control performanceElectronic commutation motor controlVector control systemsLow voltageVector control
The invention relates to a doubly-fed wind generator grid connection and power direct vector control method, which comprises the following steps of: starting a doubly-fed wind generator, introducing direct current excitation to a rotor excitation winding, and detecting the output voltage frequency of the doubly-fed wind generator; when it is determined that the output voltage frequency is the same as the power grid voltage frequency, the direct-current excitation is disconnected, and the doubly-fed wind generator is connected with the power grid; after grid connection, an excitation power supply is connected, the voltage of an excitation winding is detected, and the voltage of the excitation winding is utilized to adjust the output voltage of the excitation power supply; and adjusting the output voltage of the excitation power supply to respectively carry out grid-connected reactive current control and grid-connected active current control of the doubly-fed wind generator. According to the invention, grid-connected operation of the doubly-fed wind driven generator without the rotating speed sensor is realized, and active power and reactive power control is effectively carried out; generator excitation winding voltage is synchronously tracked to realize generator grid-connected operation power control, and good dynamic control performance and high and low voltage ride through functions are realized.
Owner:HARBIN UNIV OF SCI & TECH

High-performance all-solid-state secondary battery equipped with stabilized positive electrode sheet

PendingCN122091676Aimproved physical contactReduce initial interface impedanceCell electrodesFinal product manufactureSolid state electrolyteAll solid state
This invention relates to the field of all-solid-state secondary battery technology and discloses a high-performance all-solid-state secondary battery equipped with a stabilized positive electrode, comprising a positive electrode, a negative electrode layer, and a solid electrolyte layer. The positive electrode is manufactured by coating and drying a slurry containing 80%-88% positive electrode active material, 10%-16% sulfide solid electrolyte, 1%-2% conductive agent, and 1%-2% binder, followed by a heat-pressurization treatment at 100℃-250℃ and 10MPa-100MPa. This invention constructs a dense interface stabilization layer in situ between the positive electrode active material and the sulfide electrolyte by applying a thermo-pressure coupling treatment to the positive electrode precursor. This stabilization layer improves the physical contact between the solid and solid interfaces and reduces interfacial impedance. Simultaneously, this stabilization layer acts as a physical barrier, inhibiting the oxidative decomposition of the electrolyte under high voltage, slowing capacity decay, and improving the battery's cycle life and structural stability.
Owner:GUANGDONG OUWEI LIGHTING ELECTRIC TECH CO LTD

Highly reliable package structure and packaging method for hall current sensor

PendingCN122709766Aimprove matchImprove mechanical structure strength
The application discloses a high-reliability packaging structure of a Hall current sensor and a packaging method thereof. The structure comprises a substrate, a Hall current sensor chip and a through-flow sheet. The chip is inverted and buckled on the top surface of the substrate, and the chip and the through-flow sheet are electrically connected to the top surface of the substrate in a fixed connection mode. A ring frame and a cover plate are also fixed on the substrate. The cover plate covers the ring frame to enclose the space formed by the ring frame and the substrate. The through-flow sheet comprises a connecting part and a channel part. The connecting part is a certain distance away from the chip, and the channel part is insulated from the back surface of the chip and is used for leading a detection current into the sensing area of the chip.
Owner:BEIJING SHENGYU TECH CO LTD