Vacuum equipment for vacuum welding or annealing of semiconductor chip

Abstract

The invention relates to vacuum equipment for vacuum welding or annealing of a semiconductor chip, and the equipment comprises a vacuum cabin and a vacuum cabin upper cover, and further comprises a translation mechanism, wherein the translation mechanism is connected with the vacuum cabin upper cover and can drive the vacuum cabin upper cover to horizontally move relative to the vacuum cabin; Theequipment also comprises a lifting mechanism which is connected with the vacuum cabin upper cover and can drive the vacuum cabin upper cover to move up and down relative to the vacuum cabin. The vacuum chamber upper cover can move up and down and horizontally relative to the vacuum chamber, the opening and closing door does not occupy the position of an input port, robot automatic feeding is moreconvenient, products can be vertically and automatically input, the top space of a welding area in the vacuum chamber can be increased, robot or mechanical arm automatic feeding and discharging are convenient, and the problem that horizontal input of heavy-load products easily causes scratching of the jig carrying table is effectively solved.

Description

technical field [0001] The invention relates to the technical field of high vacuum eutectic furnace, in particular to a vacuum equipment used for vacuum welding or annealing of semiconductor chips. Background technique [0002] Existing vacuum equipment for vacuum welding or annealing of semiconductor chips (for example, vacuum eutectic furnaces for processing electronic components) mostly adopts a lift-up door structure, a side-hung door structure, and a side-side vertical lift door structure, etc., as follows: [0003] Lifting door structure, the door (vacuum chamber upper cover) is set on the top of the vacuum chamber (vacuum chamber), hinged with the box body, and can be lifted up manually or automatically. [0004] Swing door structure, the door is arranged on any side around the cavity, the door is hinged with the cavity in the vertical direction, the door can be opened horizontally, most of the swing door structures are manually opened. [0005] The vertical lifting ...

AI Technical Summary

Problems solved by technology

[0006] The disadvantages of the existing vacuum equipment for vacuum welding or annealing of semiconductor chips are that the hinges will be pressed tightly by the side-hung doors and the lift-up doors, and the far-end door will be tilted, so more pressing devices are added.

For heavy-duty and high-precision products, there will be problems such as offset

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