Photoresist structure, graphical deposition layer, semiconductor chip, and manufacturing methodd of photoresist structure, graphical deposition layer and semiconductor chip

Abstract

The embodiment of the invention provides a photoresist structure, a graphical deposition layer, a semiconductor chip, and manufacturing methods of the photoresist structure, the graphical deposition layer and the semiconductor chip. According to the manufacturing method of the photoresist structure, a single photoresist is utilized, the second photoresist layer containing the undercut can be obtained only by using a single developing solution for one-time development, and the size of the undercut can be controlled through the development time, so the problems of stripping difficulty and the like caused by adhesion of a deposition material and the side wall of the photoresist structure in a traditional stripping process are avoided; the first photoresist layer is used as a protective adhesive layer, so that corrosion damage of a developing solution to a substrate material during development can be avoided; and the first photoresist layer is etched, so that the first photoresist layer serving as a protective adhesive layer is converted into a pattern limiting adhesive layer, lateral diffusion at the bottom of a deposition material can be effectively prevented in the material deposition process, and the deposition layer with good morphology is obtained.

Description

technical field [0001] The invention relates to the technical field of micro-nano processing, in particular to a photoresist structure, a patterned deposition layer, a semiconductor chip and a manufacturing method thereof. Background technique [0002] In the field of micro-nano processing technology, most of the processing technology, such as lift-off technology, needs to be realized by preparing a special photoresist structure. [0003] Taking the lift-off process as an example, the following problems have always existed in the traditional technology: first, the sidewall of the deposition material is easy to adhere to the sidewall of the photoresist, resulting in poor morphology of the patterned deposition layer; second, the photoresist pattern During the chemicalization process, the developer will react with the substrate material and cause corrosion to the substrate material. [0004] For the first problem, it can usually be solved by preparing a photoresist structure c...

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