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Display panel and display device

A technology for display panels and display areas, applied in identification devices, instruments, etc., can solve the problems of large differences in expansion and contraction scales of driver chips and glass substrates, uneven stress, and different thermal expansion coefficients, etc., to improve display quality and Process yield and the effect of improving stress unevenness

Active Publication Date: 2021-04-16
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the glass substrate of the driver chip and the display panel belong to two different materials, the thermal expansion coefficients of the two are different. Therefore, during the process of high-temperature thermocompression bonding and cooling to room temperature, the expansion and contraction scales of the driver chip and the glass substrate are very different. Large, there is a large stress accumulation at the interface between the two materials. After removing the indenter, the glass in the bonding area where the driver chip is located is warped and deformed, resulting in uneven display in the nearby display area and the formation of stress mura (uneven) phenomenon.

Method used

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  • Display panel and display device

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0024] Embodiments of the present application provide a display panel and a display device. Each will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms first, second, third, etc. are used for designation only and do not impose numerical requi...

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Abstract

The embodiment of the invention discloses a display panel and a display device, the display panel comprises a display area and a binding area located on one side of the display area, and the display panel further comprises a first substrate and an electronic device; wherein the first substrate comprises a film layer located in the binding area, and the film layer is provided with a plurality of first grooves; the electronic device is located on the film layer and located in the binding area; and the plurality of first grooves correspond to the electronic device. According to the embodiment of the invention, the phenomenon of uneven stress in the binding area of the electronic device in the display device can be effectively improved, and the display quality and the process yield of the display device are further improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display panel and a display device. Background technique [0002] With the wide application of display devices (such as mobile phones), full screen or high screen-to-body ratio has become an important technical index for measuring display devices. Therefore, the technology of realizing narrow borders under the display panel is becoming more and more important. The display device generally includes a display panel cell, a printed circuit board PCB, a driver chip (IC), etc., wherein the display panel and the driver chip generally use COG (Chip OnGlass, the chip is fixed on the glass substrate) through an anisotropic conductive adhesive (Anisotropic ConductiveFilm) , ACF) connection, and the printed circuit board and display panel are connected through a flexible circuit board (FPC). [0003] During the research and practice of the existing technology, the inventors of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/00
Inventor 聂晓辉
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD