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Fine line etching solution

A technology of fine circuit and etching solution, which is applied in the direction of removing conductive materials by chemical/electrolytic methods, can solve the problems of excessive loss of key metals and affecting the quality of circuit boards, so as to reduce hazards, prevent corrosion, and improve The effect of pass rate

Inactive Publication Date: 2021-04-20
江西遂川光速电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the etching process, it is inevitable that some key metals will be lost too much, which will affect the quality of the circuit board.

Method used

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  • Fine line etching solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A kind of fine line etchant, the composition of described etchant comprises:

[0019] Inorganic acidic liquid, based on the total weight of the etching liquid composition, the content is 50%;

[0020] Organic acid solution, based on the total weight of the etching solution composition, the content is 30%;

[0021] Buffer etchant (BOE), based on the total weight of the etching solution composition, the content is 5%; aluminum etchant, based on the total weight of the etching solution composition, the content is 5%;

[0022] Copper protective agent, based on the total weight of the etching solution composition, the content is 5%;

[0023] The molybdenum protective agent has a content of 5% based on the total weight of the etching solution composition.

Embodiment 2

[0025] A kind of fine line etchant, the composition of described etchant comprises:

[0026] Inorganic acidic liquid, based on the total weight of the etching liquid composition, the content is 45%;

[0027] Organic acid solution, based on the total weight of the etching solution composition, the content is 25%;

[0028] Buffer etchant (BOE), based on the total weight of the etching solution composition, the content is 10%; aluminum etchant, based on the total weight of the etching solution composition, the content is 10%;

[0029] Copper protective agent, based on the total weight of the etching solution composition, the content is 5%;

[0030] The molybdenum protective agent has a content of 5% based on the total weight of the etching solution composition.

Embodiment 3

[0032] A kind of fine line etchant, the composition of described etchant comprises:

[0033] Inorganic acidic liquid, based on the total weight of the etching liquid composition, the content is 40%;

[0034] Organic acid solution, based on the total weight of the etching solution composition, the content is 20%;

[0035] Buffer etchant (BOE), based on the total weight of the etching solution composition, has a content of 15%; aluminum etchant, based on the total weight of the etching solution composition, has a content of 15%;

[0036] Copper protective agent, based on the total weight of the etching solution composition, the content is 5%;

[0037] The molybdenum protective agent has a content of 5% based on the total weight of the etching solution composition.

[0038] Extract each embodiment and analyze, and compare with prior art, draw following data:

[0039]

[0040] According to the data in the table above, it can be concluded that when implementing the parameters...

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PUM

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Abstract

The invention discloses a fine line etching solution. The fine line etching solution comprises the following components of, in percentage by weight, 30-40% of inorganic acid solution, 20-30% of organic acid solution, 5-10% of buffered oxide etch (BOE), 3-10% of aluminum etching agent, 5-10% of copper protective agent and 2-5% of molybdenum protective agent. According to the etching solution, copper, molybdenum and other key metal substances in the metal layer on a circuit board are effectively protected from being damaged during etching, and the percent of pass of circuit board etching is effectively improved.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a fine circuit etchant. Background technique [0002] The circuit board is an indispensable component in today's electronic products. It needs to be etched on its surface for wiring during processing. Since the etching ability of the etching solution for different metal materials is also different, in the multi-layer metal to be etched, the degree of etching of each layer of metal materials will also vary due to different metal types. During the etching process, it is inevitable that some key metals will be lost too much, which will affect the quality of the circuit board. Contents of the invention [0003] A kind of fine line etchant, the composition of described etchant comprises: [0004] Inorganic acidic liquid, based on the total weight of the etching liquid composition, the content is 30-50%; [0005] Organic acid solution, based on the total weight of the etching solutio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/44C23F1/20H05K3/06
Inventor 刘维富
Owner 江西遂川光速电子有限公司