Circuit board and browning method thereof
A circuit board and browning technology, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, and printed circuit manufacturing. Combining the binding force and avoiding the effect of not being able to brown
Active Publication Date: 2022-07-29
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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Problems solved by technology
Therefore, the difference in the browning effect will directly determine the bonding force between the copper surface and the prepreg. When the bonding force is insufficient, it will easily lead to the delamination of the pressing medium, and even lead to the scrapping of the production board.
[0003] However, in the process of browning the circuit board in the traditional browning method of the circuit board, there is a situation that the copper paste plug hole of the circuit board cannot be browned, which makes the pressing and bonding force of the circuit board poor, and then makes the circuit board in the process of browning. The inside of the copper paste plug hole was scrapped due to the explosion of the board
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[0041] In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.
[0042] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only ...
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Abstract
The present application provides a circuit board and a browning method thereof. The browning method of the above-mentioned circuit board includes: drilling the board part so that the board part has through holes; A copper layer; perform the plugging operation on the board after the copper sinking operation, so that the through holes formed with the first copper layer are filled with conductive blocks; perform the copper reduction operation on the board after the plugging operation to reduce the thickness of the board The thickness of the first copper layer on both sides; the plate after the copper reduction operation is subjected to a plate plating operation, so that the first copper layer on both sides of the plate and the end surface of the conductive block are respectively formed with a second copper layer; The plate after the plating operation is subjected to browning treatment. Since the second copper layer covers the first copper layer on both sides of the board and the end surfaces of the conductive blocks, the situation that the copper paste plug holes of the circuit board cannot be browned is avoided, and the pressure bonding of the circuit boards is greatly improved. force.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board and a browning method thereof. Background technique [0002] Conductive copper paste is a composition including copper powder, thermosetting resin and solvent. It has the characteristics of high reliability and high conductivity, and plays an important role in the plugging process of circuit boards. As the first step in the lamination process of circuit boards, browning is an indispensable process in the lamination process of circuit boards. Browning is a certain micro-etching of the copper surface by chemical methods, resulting in a micro-uneven surface shape, increasing the contact area of the copper surface, and the micro-etched copper surface reacts with the inner layer bonding agent to form a layer of organic metal conversion. film to enhance the bonding force between the inner layer copper and the resin, thereby enhancing the thermal shoc...
Claims
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IPC IPC(8): H05K3/06H05K3/38H05K1/09
CPCH05K3/06H05K3/383H05K1/09
Inventor 许校彬徐涛吴观福江建能
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD