Circuit board and its browning process
A circuit board and browning technology, which is applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as inability to brown, poor bonding force of circuit board, and medium layering
Active Publication Date: 2021-12-07
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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Problems solved by technology
Therefore, the difference in the browning effect will directly determine the bonding force between the copper surface and the prepreg. When the bonding force is insufficient, it will easily lead to the delamination of the pressing medium, and even lead to the scrapping of the production board.
[0003] However, in the process of browning the circuit board in the traditional browning process of the circuit board, there is a situation that the copper paste plug hole of the circuit board cannot be browned, which makes the pressing and bonding force of the circuit board poor, and then makes the circuit board in the process of browning. The inside of the copper paste plug hole was scrapped due to the explosion of the board
Method used
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[0045] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0046] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...
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Abstract
The application provides a circuit board and a browning process thereof. The browning process of the above-mentioned circuit board includes: drilling the board to form a through hole in the board; performing copper sinking operation on the drilled board to form the first copper layer on the board; Resin plug, so that the resin plug is formed with a through hole; the through hole of the plate after the copper sinking operation is filled with copper paste; the resin plug is inserted into the through hole of the plate, and the copper paste part passes through the through hole Spilling to the surface of the resin plug; providing a copper covering to match the copper covering with the stepped hole; installing the copper covering in the stepped hole so that the copper covering is connected to the resin plug through copper paste. Since the second copper layer covers the surface of the first copper layer and the copper covering body on both sides of the board respectively, the browning layer is only formed on the surface of the second copper layer, which avoids the inability to exist in the copper paste plug hole of the circuit board. The browning situation greatly improves the bonding force of the circuit board.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board and its browning process. Background technique [0002] Conductive copper paste is a composition including copper powder, thermosetting resin and solvent, which has the characteristics of high reliability and high conductivity, and plays an important role in the plugging process of circuit boards. Browning, as the first step in the circuit board lamination process, is an essential process in the circuit board lamination process. Browning is to chemically micro-etch the copper surface to produce a microscopic uneven surface shape and increase the contact area of the copper surface, and the micro-etched copper surface reacts with the inner layer bonding agent to form a layer of organic metal conversion. film to enhance the bonding force between the inner layer copper and the resin, thereby enhancing the thermal shock resistance and delamination r...
Claims
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IPC IPC(8): H05K3/38H05K3/00
CPCH05K3/0094H05K3/383
Inventor 许校彬肖尊民
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD