Circuit board and browning method thereof

Abstract

The invention provides a circuit board and a browning method thereof. The browning method of the circuit board comprises the following steps: drilling a plate to form a through hole in the plate; performing electroless plating copper operation on the drilled plate, so that a first copper layer is formed on the surface of the plate and the inner wall of the through hole; carrying out hole plugging operation on the plate after the copper deposition operation, so that the through hole formed with the first copper layer is filled with a conductive block; performing copper reduction operation on the plate after the hole plugging operation so as to reduce the thickness of the first copper layers on the two sides of the plate; carrying out plate plating operation on the plate after the copper reduction operation, so that second copper layers are respectively formed on the first copper layers on the two sides of the plate and the end part surfaces of the conductive blocks; and carrying out browning treatment on the plate subjected to the plate plating operation. Since the second copper layer respectively covers the first copper layer and the end surface of the conductive block on the two sides of the board, the condition that browning cannot be performed in a copper paste plug hole of the circuit board is avoided, and the lamination binding force of the circuit board is greatly improved.

Description

Technical field[0001]The present invention relates to the technical field of wire board production, and more particularly to a circuit board and a brimination method thereof.Background technique[0002]Conductive copper paste is a composition comprising copper powder, thermosetting resin, and solvent, with high reliability and high electrical resistance, etc., it has an important role in the plug process of the circuit board. The first step of browning as a lamination step of the circuit board is an indispensable process in the circuit board pressing process. The browning is a certain amount of absthesion to the copper surface by chemical method, producing a microscopic uneven surface shape, increasing the contact area of ​​the copper surface, while the copper surface after the abduction forms a layer of organometallic conversion The film is enhanced to enhance the binding force of the inner layer copper and the resin, thereby enhancing the thermal shock of the wiring board and the re...

AI Technical Summary

Problems solved by technology

Therefore, the difference in the browning effect will directly determine the bonding force between the copper surface and the prepreg. When the bonding force is insufficient, it will easily lead to the delamination of the pressing medium, and even lead to the scrapping of the production board.

[0003] However, in the process of browning the circuit board in the traditional browning method of the circuit board, there is a situation that the copper paste plug hole of the circuit board cannot be browned, which makes the pressing and bonding force of the circuit board poor, and then makes the circuit board in the process of browning. The inside of the copper paste plug hole was scrapped due to the explosion of the board

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