Circuit board assembly
A circuit board and component technology, applied in the directions of printed circuit components, printed circuits, electrical components, etc., can solve the problems of medium layering, scrapped production boards, poor bonding force of circuit board components, etc., to improve the bonding force of pressing. Effect
Active Publication Date: 2021-05-04
HUIZHOU TECHUANG ELECTRONIC TECH CO LTD
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Problems solved by technology
Therefore, the difference in the browning effect will directly determine the bonding force between the copper surface and the prepreg. When the bonding force is insufficient, it will easily lead to the delamination of the pressing medium, and even lead to the scrapping of the production board.
[0003] However, for the structure of the traditional circuit board assembly after browning, there is no browning layer in the copper paste plug hole of the circuit board assembly, so the bonding force of the circuit board assembly is poor after pressing, especially in the copper paste plug hole. The position corresponding to the hole, thus making the service life of the circuit board assembly shorter
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[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0034] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...
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The invention provides a circuit board assembly. The circuit board assembly comprises a board piece, two first copper layers, a middle conductive column, a first copper covering body, a second copper covering body, two second copper layers and two brownification layers, wherein the board piece is provided with a first conduction plug hole; the two first copper layers are formed on the two opposite side faces of a first plate respectively, and each first copper layer is provided with a second conduction plug hole communicating with the first conduction plug hole; and the first conduction plug hole is filled with the middle conductive column, the middle conductive column comprises a copper paste block and two resin plug pieces, and each resin plug piece is provided with a through hole. According to the invention, the two brownification layers are respectively formed on the surfaces, deviating from the first copper layers, of the two second copper layers, so the brownification layers only need to be formed on the surfaces of the second copper layers, the situation that brownification cannot be carried out in copper paste plug holes of the circuit board assembly is avoided, the pressing binding force of the circuit board assembly is greatly improved, and the service life of the circuit board assembly is further prolonged.
Description
technical field [0001] The invention relates to the technical field of circuit board assembly production, in particular to a circuit board assembly. Background technique [0002] Conductive copper paste is a composition including copper powder, thermosetting resin and solvent, which has the characteristics of high reliability and high conductivity, and plays an important role in the plugging process of circuit board components. As the first step in the lamination process of circuit board components, browning is an essential process in the process of circuit board component lamination. Browning is to chemically micro-etch the copper surface to produce a microscopic uneven surface shape and increase the contact area of the copper surface, and the micro-etched copper surface reacts with the inner layer bonding agent to form a layer of organic metal conversion. film to enhance the bonding force between the inner layer copper and the resin, thereby enhancing the thermal shock ...
Claims
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IPC IPC(8): H05K3/00H05K1/11H05K3/38H05K3/40
CPCH05K1/11H05K3/0094H05K3/382H05K3/4038
Inventor 许校彬肖尊民
Owner HUIZHOU TECHUANG ELECTRONIC TECH CO LTD