Wafer cleaning device capable of dynamically adjusting postures

A cleaning device and dynamic adjustment technology, applied in the cleaning method using tools, cleaning method using liquid, cleaning method and utensils, etc., can solve the problem of affecting cleaning effect, unstable wafer brushing speed, inconsistent response time of cleaning solution, etc. problem, to achieve the effect of improving cleaning effect, improving consistency and stable speed

Inactive Publication Date: 2021-04-30
HWATSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the prior art, there is the problem of unstable rotation speed during wafer scrubbing, which will affect the consistency of cleaning liquid spraying, make the reaction time of cleaning liquid on the wafer surface inconsistent, and ultimately affect the cleaning effect

Method used

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  • Wafer cleaning device capable of dynamically adjusting postures
  • Wafer cleaning device capable of dynamically adjusting postures
  • Wafer cleaning device capable of dynamically adjusting postures

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Embodiment Construction

[0030]The technical solution of the present invention will be described in detail below in conjunction with specific embodiments and drawings. The embodiments described herein are the specific embodiments of the present invention, and the concepts of the present invention are intended to illustrate the present invention; those explanatory and exemplary are not to be construed as limiting the scope of the invention . In addition to the implementation exceptions described herein, those skilled in the art can also use obvious other technical solutions based on the claims disclosed in the present application and the description thereof, including any of the embodiments of the embodiments described herein. Obviously replacement and modification technology solutions. It should be understood that, unless otherwise stated, in order to facilitate understanding, the description of the specific embodiments of the present invention is established in the related equipment, means, components, or ...

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Abstract

The invention discloses a wafer cleaning device capable of dynamically adjusting postures. The wafer cleaning device comprises a wafer rotating assembly, two cleaning brushes, a cleaning brush moving mechanism and a controller, wherein the wafer rotating assembly is used for supporting a wafer and driving the wafer to rotate, and comprises a driving roller and a driven roller, and the driving roller is provided with a rotating speed sensor which is used for detecting the rotating speed of the wafer. The two cleaning brushes are arranged on the two sides of the wafer and roll around the axes of the cleaning brushes to brush the surface of the wafer. The cleaning brush moving mechanism is used for driving the two cleaning brushes to move oppositely and clamping the wafer at a certain included angle for brushing. The controller is used for detecting the rotating speed of the wafer by utilizing the rotating speed sensor and controlling the cleaning brush moving mechanism to adjust the included angle between the two cleaning brushes when the rotating speed does not belong to the normal range.

Description

Technical field[0001]The present invention belongs to the field of cleaning techniques after chemical mechanical polishing, and more particularly to a wafer cleaning device that can dynamically adjust the posture.Background technique[0002]Chemical Mechanical Polishing (CMP) is a global flattened ultra-precision surface processing process. Since a large number of chemical reagents and abrasives in chemical mechanical polishing will remain in the wafer surface after polishing, a large amount of polishing particles and polishing substances such as pollutants are adversely affected by subsequent processes, and may cause crystals. Radiang rate loss. Since the cleaning of the wafer surface is one of the important factors affecting the reliability of the semiconductor device, in order to achieve the contaminant of the wafer surface, the contaminants of the wafer surface need to be removed to avoid the process of contaminants in the process. surface. Therefore, in the wafer manufacturing pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/02B08B13/00H01L21/02B08B3/02
CPCB08B1/002B08B1/02B08B3/022B08B13/00H01L21/02043
Inventor 许振杰王同庆
Owner HWATSING TECH
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