PCB and layer skewness control quality detection mechanism thereof

Abstract

The invention discloses a layer skewness control quality detection mechanism. The mechanism comprises detection packages arranged at the same positions of the surfaces of all layers of core boards, and each detection package comprises a grounding hole which is formed in the surface of the corresponding core board and used for being connected with any electrode of PCB electrical testing equipment, and an electrical testing hole which is formed in the surface of the core plate, has a preset distance with the grounding hole and is used for being connected with the other electrode of the PCB electrical testing equipment, and the hole diameter of the grounding holes and the hole diameter of the electrical testing holes are equal to the hole diameter of a minimum via hole formed in the PCB. Annular vacant areas are formed in the conductor layers laid on the surfaces of the core plates in the mode of extending outwards from the hole walls of the electric measuring holes, and the radial length of the annular vacant areas is the allowable maximum layer skewness. The layer skewness control quality detection mechanism disclosed by the invention can improve the detection operation efficiency of PCB layer skewness control quality, improve the precision and reliability of a detection result, and meet the design requirements of a high-density board. The invention also discloses a PCB, and the beneficial effects of the PCB are as described above.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a layer skewness control quality detection mechanism. The invention also relates to a PCB. Background technique [0002] Due to market demand, more and more high-density boards need to be designed in the design and development of PCB boards, but the system does not reduce the SI / PI performance of high-density boards. In this way, the design of high-density boards must be squeezed to the limit in terms of space utilization. The design of the spacing between holes and copper needs to be reduced, but the requirements for signal integrity require signal traces to have a complete reference layer, and the traces cannot be separated. , Can not be too close to the edge of the reference layer. Due to the inevitable precision deviation and process tolerance in industrial manufacturing, the processing of high-density boards is a difficult problem for the PCB manufacturing industry. [0003] ...

AI Technical Summary

Problems solved by technology

However, although this method can check whether the skewness of the PCB layer is qualified, but the number of vias is large, it will take too long to perform electrical testing on each via, and the inspection efficiency is low; if only some vias are electrically tested Due to the different hole diameters of different vias, there will be contradictions in which some vias pass the inspection results and some vias fail the inspection results.

In short, the existing technology for the inspection of PCB layer skewness control quality is either low in operation efficiency, or the accuracy of inspection results is low, and it is difficult to meet the design requirements of high-density boards.

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