Circuit board and its non-inductive scratch repair process

A circuit board and process technology, applied in the field of circuit board and its non-inductive scratch repair process, can solve problems such as the elimination of difficult appearance, circuit board scratches, and complicated circuit board preparation process, so as to improve the repair effect and improve the appearance Effect
CN112739023BActive Publication Date: 2022-01-18CAMELOT QINGYUAN HYTEC TECH INVESTMENT
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CAMELOT QINGYUAN HYTEC TECH INVESTMENT
Publication Date
2022-01-18

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Abstract

The present application provides a non-inductive scratch repair process for circuit boards. The above-mentioned non-inductive rubbing repair process for circuit boards includes the following steps: obtaining untreated walnut kernels; performing a first rolling operation on the walnut kernels to obtain walnut kernel mud; adding Vaseline to the walnut kernel mud for a second rolling operation , to obtain mixed walnut kernel paste; solidify and form the mixed walnut kernel paste to obtain a non-inductive scratch restoration; obtain a circuit board after solder masking, wherein there are non-inductive scratches on the solder mask layer of the circuit board; Squeeze and wipe the circuit board after the solder resistance with the scratch-scratch restoration body to obtain the repaired circuit board. The above-mentioned non-inductive scratch repair process for circuit boards can better repair the non-inductive scratches and improve the appearance of the circuit board.
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Description

technical field

[0001] The invention relates to the technical field of circuit boards, in particular to a circuit board and its non-inductive scratch repair process. Background technique

[0002] The preparation process of circuit boards is complicated, and may need to be transferred to multiple assembly lines for processing during the preparation process. During each transfer and processing process, there may be problems with scratches on circuit boards, and it is difficult to distinguish and more common. The surface of the solder resist layer is scratched, and there are two types of scratches. One is felt scratches. Obvious scratches can be seen on the surface of the solder mask and the existence of scratches can be clearly felt after contact. The scratches formed by scratches will seriously affect the quality of the circuit board; the other is non-inductive scratches, where obvious scratches can be seen on the surface of the solder mask but cannot be clearly felt after co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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