Computer heat dissipation mechanism

Abstract

The invention discloses a computer heat dissipation mechanism, and relates to the technical field of computer equipment. The box comprises a box body and a heat dissipation part, wherein a slotted hole is formed in the bottom of the box body. The heat dissipation part comprises a bottom plate, a heat dissipation plate and an impeller, the bottom plate is fixed in the groove hole of the box body, the heat dissipation plate is installed on the inner side face of the bottom plate, a rotating part rotating along with flowing of liquid is installed in the heat dissipation plate, a transmission shaft is installed on the rotating part and extends to the outer side of the bottom plate, and meanwhile the impeller is rotationally installed at the extending end of the transmission shaft. Cooling liquid enters the communicated groove holes through the liquid inlet channels, the rotating parts installed in the groove holes are pushed to rotate, the cooling liquid is driven to flow, flowing of the cooling liquid in the heat dissipation plate is completed, and rapid heat dissipation is achieved.

Description

technical field [0001] The invention belongs to the technical field of computer equipment, in particular to a computer cooling mechanism. Background technique [0002] Due to the long-term work of the fan and the effect of the heat dissipation holes inside the case, a lot of dust will adhere to the electrical components inside the case. If the dust is not cleaned in time, it will cause the entire computer to be unable to dissipate heat and affect the normal use of the computer. The accumulated dust This leads to poor heat dissipation of the chassis. Therefore, the existing way is to open the cover plate of the chassis and use some cleaning tools such as hairbrush to clean up the dust on it. The cover cannot be opened without special tools. Due to the need to open the cover to remove dust, people often ignore the habit of removing dust during use, resulting in long-term dust accumulation affecting the normal use of the computer, and when it is found that the computer cannot...

AI Technical Summary

Problems solved by technology

[0002] Due to the long-term work of the fan and the effect of the heat dissipation holes inside the case, a lot of dust will adhere to the electrical components inside the case. If the dust is not cleaned in time, it will cause the entire computer to be unable to dissipate heat and affect the normal use of the computer. The accumulated dust This leads to poor heat dissipation of the chassis

Therefore, the existing way is to open the cover plate of the chassis and use some cleaning tools such as hairbrush to clean up the dust on it. The cover cannot be opened without special tools

Due to the need to open the cover to remove dust, people often ignore the habit of removing dust during use, resulting in long-term dust accumulation affecting the normal use of the computer, and when it is found that the computer cannot be used normally due to too thick dust, its working components may be Unable to effectively dissipate heat and burn out due to overheating, thus causing economic losses

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