Electroplating environment air circulation system

A circulation system and ambient air technology, applied in the field of air purification, can solve the problems of poor air quality, troubles, and inability to suction waste waste, etc.

Active Publication Date: 2021-05-14
CHONGQING TAOYUAN METAL SURFACE TREATMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The product needs to be polished on the grinding table before electroplating. The waste generated during the grinding process will cause the air quality of the electroplating environment to deteriorate. Therefore, it is usually necessary to install a waste suction device on the grinding table. The generated waste chips are sucked and filtered, and then the air is added to the electroplating environment; however, since the filter screen for filtering the waste chips is full of waste chips, it is impossible to continue to suction the waste chips, and it is necessary to artificially clean the waste chips from time to time. It is very troublesome to clean up the debris on the filter

Method used

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  • Electroplating environment air circulation system
  • Electroplating environment air circulation system
  • Electroplating environment air circulation system

Examples

Experimental program
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Embodiment

[0021] The embodiment is basically as attached Figure 1-3 Shown: as figure 1 The air circulation system of electroplating environment shown includes suction pipe 1, push block 2, connecting strip 3, trapezoidal strip 4, filter screen 5, filter plate 6, L-shaped rod 7, shielding frame 8 and cleaning mechanism; suction pipe 1 is bent, the suction pipe 1 includes a first horizontal pipe, a vertical lower pipe, a second horizontal pipe, a vertical upper pipe and a third horizontal pipe, each component of the suction pipe 1 is in the shape of a cuboid, and the shielding frame 8 and The vertical lower pipe, the second horizontal pipe and the vertical upper pipe form a closed space 9, and the right end of the suction pipe 1 is connected with a baffle plate 15 through pin rotation, and the left end of the suction pipe 1 is positioned at the grinding table.

[0022] like figure 2 As shown, the push block 2, the connecting bar 3, the trapezoidal bar 4, the filter screen 5, the filte...

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Abstract

The invention relates to the field of air purification, in particular to an electroplating environment air circulation system which comprises a suction pipe, a push block, a connecting strip, a trapezoidal strip, a filter screen, a filter plate, an L-shaped rod and a cleaning mechanism. A suction pump is mounted in the suction pipe, and one end of the suction pipe is rotationally connected with a baffle; the push block, the connecting strip, the trapezoidal strip, the filter screen, the filter plate and the L-shaped rod are sequentially connected, the push block, the trapezoidal strip and the filter plate are all slidably connected with the side wall of the suction pipe, a sliding groove is formed in the baffle, and the free end of the L-shaped rod is slidably arranged in the sliding groove; the cleaning mechanism comprises a scraping piece and a plurality of cleaning units, each cleaning unit comprises a supporting rod and an elastic piece, one end of each supporting rod is fixedly connected with the corresponding scraping piece, the other end of each supporting rod is slidably connected with the side wall of the suction pipe, and the supporting rods are sleeved with the elastic pieces. When the technical scheme is adopted, the waste chips in the electroplating environment can be conveniently and continuously treated.

Description

technical field [0001] The invention relates to the field of air purification, in particular to an electroplating environment air circulation system. Background technique [0002] The product needs to be polished on the grinding table before electroplating. The waste generated during the grinding process will cause the air quality of the electroplating environment to deteriorate. Therefore, it is usually necessary to install a waste suction device on the grinding table. The generated waste chips are sucked and filtered, and then the air is added to the electroplating environment; however, since the filter screen for filtering the waste chips is full of waste chips, it is impossible to continue to suction the waste chips, and it is necessary to artificially clean the waste chips from time to time. It is very troublesome to clean up the debris on the filter screen. Contents of the invention [0003] The object of the present invention is to provide a system that facilitates...

Claims

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Application Information

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IPC IPC(8): B01D46/10B01D46/00
CPCB01D46/0047B01D46/10B01D46/90B01D46/76
Inventor 符士正何超
Owner CHONGQING TAOYUAN METAL SURFACE TREATMENT
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