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Welding device and method for microchannel liquid-cooled cold plate

A welding device and micro-channel technology, applied in welding equipment, arc welding equipment, milling machine equipment, etc., can solve problems such as liquid leakage

Pending Publication Date: 2021-05-28
NANYANG INST OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the problems existing in the existing direct brazing technology, the present invention provides a welding device and method for a micro-channel liquid-cooled plate, so as to solve the problem that the part where the contact area between the cover plate and the micro-channel substrate is small is not easy to be detached under pressure. Welding, leakage and other defects

Method used

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  • Welding device and method for microchannel liquid-cooled cold plate
  • Welding device and method for microchannel liquid-cooled cold plate
  • Welding device and method for microchannel liquid-cooled cold plate

Examples

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Effect test

Embodiment 1

[0026] like figure 1 , Figure 2A , Figure 2B , Figure 3A , Figure 3B Shown, a kind of welding device of the liquid cold plate of microchannel is characterized in that: at least comprise microchannel substrate 2 and cover plate 1, described microchannel substrate 2 and cover plate 1 have identical area and shape, in the same The position of the microchannel substrate 2 and the cover plate 1 respectively have 4 rows of cable connector via holes 3, each row of cable connector via holes 3 has 4, and the side of the cover plate 1 has a through groove 9 on the side of the 3 rows of cable connector via holes , there are bosses 6 on one side of the three rows of cable connector holes arranged side by side on the microchannel substrate 2, and the through grooves 9 are used on the cover plate 1 to cooperate with the bosses 6 of the microchannel substrate 2, and the bosses 6 are on the microchannel substrate 2 Welding weak points are designed; there are coolant inflow riser 4 and...

Embodiment 2

[0038] see figure 1 , Figure 2A , Figure 2B , Figure 3A , Figure 3B , a welding device for a liquid-cooled plate of a microchannel, characterized in that: at least including a microchannel substrate 2 and a cover plate 1, the microchannel substrate 2 and the cover plate 1 have the same area and shape, and at the same position The microchannel substrate 2 and the cover plate 1 respectively have 4 rows of cable connector via holes 3, and each row of cable connector via holes 3 has 5, and the side of the 3 rows of cable connector via holes arranged side by side on the cover plate 1 has a through groove 9. There are bosses 6 on one side of the three rows of cable connectors arranged side by side on the channel substrate 2, and the through grooves 9 are used to cooperate with the bosses 6 of the microchannel substrate 2 on the cover plate 1. The welding of the bosses 6 on the microchannel substrate 2 is weak. design; at the two opposite corners of the cover plate 1 there ar...

Embodiment 3

[0041] see figure 1 , Figure 2A , Figure 2B , Figure 3A , Figure 3B, a welding device for a liquid-cooled plate of a microchannel, characterized in that: at least including a microchannel substrate 2 and a cover plate 1, the microchannel substrate 2 and the cover plate 1 have the same area and shape, and at the same position The microchannel substrate 2 and the cover plate 1 have m columns of cable joint via holes 3 respectively, and each column of cable joint via holes 3 has n, and the m and n are not greater than 5, when m=3, n=3, wherein There are through grooves 9 on one side of the three rows of cable connector holes arranged side by side on the cover plate 1, and there are bosses 6 on one side of the three rows of cable connector holes arranged side by side on the microchannel substrate 2. The boss 6 of the channel substrate 2 is used together, and the boss 6 is designed at the welding weak point of the microchannel substrate 2; there are cooling liquid inflow ri...

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Abstract

The invention relates to the technical field of direct brazing of microchannel liquid-cooled cold plates, in particular to a welding device and method for a microchannel liquid-cooled cold plate. The welding device is characterized by comprising at least a microchannel base plate and a cover plate, wherein the microchannel base plate and the cover plate have the same area and shape; the microchannel base plate and the cover plate are separately provided with m rows of cable joint via holes at corresponding positions; n cable joint via holes are arranged in each row; one side of each of the n rows of cable joint via holes formed side by side in the cover plate is provided with corresponding through grooves; one side of each of the n rows of cable joint via holes formed side by side in the microchannel base plate is provided with corresponding bosses; the through grooves in the cover plate are used in cooperation with the bosses on the microchannel base plate; the bosses are designed at weak welding positions of the microchannel base plate; a coolant inflow riser and a coolant outflow riser are separately arranged on two opposite corners of the cover plate; and the cover plate and the microchannel base plate are welded by direct brazing. The welding device and method for the microchannel liquid-cooled cold plate solve the defect that positions where contact areas between the cover plate and the microchannel base plate are relatively small are prone to loose welding, liquid leakage and the like under pressure.

Description

technical field [0001] The invention relates to the technical field of direct brazing of a micro-channel liquid-cooled plate, in particular to a welding device and method for a micro-channel liquid-cooled plate. Background technique [0002] In recent years, the application of phased array radar has become more and more extensive, and the integration degree of phased array antenna is getting higher and higher. Thousands of T / R components are integrated in the limited space of the phased array radar. During the operation of the radar, the T / R components generate a lot of heat, especially the application of GaN devices in the past few years, making the power density of the device Reaching more than three times before, component assembly density, power consumption and heat load increase rapidly. The micro-channel liquid cooling plate is an ideal heat dissipation device, and the micro-channel liquid cooling plate has been widely used as a heat dissipation device in phased array...

Claims

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Application Information

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IPC IPC(8): B23K9/007B23K9/16B23C3/00
CPCB23K9/007B23K9/16B23C3/00
Inventor 王海红季祥李仁刘宁宁翟天嵩盖晓华刘忠超张季萌屈保中
Owner NANYANG INST OF TECH
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