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A method for controlling the stacking device to automatically adjust the stacking height

An automatic adjustment and stacking device technology, which is applied in the direction of conveyor control device, unstacking of objects, stacking of objects, etc., can solve the problems of maintenance and repair inconvenience, increase of product defective rate, and complex overall structure, etc., and achieve improvement Yield rate, improving stability and accuracy, and simplifying the overall structure

Active Publication Date: 2022-04-22
ACCUTECH SHENZHEN CO LTD
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Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, provide a method for controlling the lamination device to automatically adjust the lamination height, and solve the problem that in the prior art, vibrations are easily caused when lifting and lowering the loading platform, resulting in material displacement and an increase in the defective rate of products problems; to solve the problem that an external lifting mechanism is required, resulting in a complex overall structure and inconvenient maintenance and repair

Method used

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  • A method for controlling the stacking device to automatically adjust the stacking height
  • A method for controlling the stacking device to automatically adjust the stacking height
  • A method for controlling the stacking device to automatically adjust the stacking height

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Embodiment Construction

[0036] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0037] Please refer to Figure 1- Figure 2 , the present invention provides a method of controlling the stacking device to automatically adjust the stacking height, comprising the following steps:

[0038] S1: Correct the position of the first transfer agency 4 and the second transfer agency 5 in the vertical direction respectively, so that the distance between the first transfer mechanism 4, the second transfer mechanism 5 and the bearing platform 3 in the vertical direction is L1 and L2, respectively.

[0039] The first transfer mechanism 4, the second transfer mechanism 5 are used to grab the first tooling body 1, the first plate on the second tooling body 2, the second plate.

[0040] S2: Gets the ingredient information for the combination plate to be stacked.

[0041] In the present embodiment, the combination plate is a PCP plate + CSC plate; hav...

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Abstract

The invention discloses a method for controlling the stacking device to automatically adjust the stacking height, which includes the following steps: respectively correcting the positions of the first transfer mechanism and the second transfer mechanism, so that the first transfer mechanism, the second transfer mechanism and the bearing platform are vertically aligned. The distances in the vertical direction are L1 and L2 respectively; obtain the batching information of the composite boards to be stacked; according to the batching information, the values ​​of L1 and L2, respectively calculate the first transfer mechanism to transport each first board in the composite boards to the loading The height H1 to be lowered at the stacking position on the platform, and the height H2 to be lowered when the second moving mechanism transports each second plate in the combined plate to the stacking position on the carrier platform; according to the stacking order in the ingredient information and the values ​​of H1 and H2 are sequentially stacked on the first plate and the second plate. The control process of the present invention is simple and fast, and the lamination device can realize automatic lamination without an external lifting mechanism, which improves the stability and accuracy of the lamination process, and further improves the yield of products.

Description

Technical field [0001] The present invention relates to the field of circuit board processing, in particular to a method of controlling the stacking device to automatically adjust the stacking height. Background [0002] When the stacking device is processed on the circuit board, the bearing table is stacked on multiple materials in turn, with the superposition of materials, the material height on the bearing table increases accordingly, at this time, the bearing platform is usually used to adapt to the transfer mechanism to stack the material on the bearing table, therefore, the bearing platform needs to be additionally set up to achieve the function of lifting and lowering the table, so that the position of the material surface on the bearing table is always maintained at the same height. However, the lifting and lifting platform will inevitably cause vibration phenomena, resulting in displacement between materials, poor product stability, resulting in an increase in product d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G61/00B65G47/24B65G43/08
CPCB65G61/00B65G47/24B65G43/08B65G2201/02
Inventor 杨海涛李奉远周振宇
Owner ACCUTECH SHENZHEN CO LTD
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