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Intelligent mainboard for improving repair efficiency by using spring framework

A motherboard, high-efficiency technology, applied in the direction of electrical digital data processing, digital processing power distribution, digital data processing components, etc., can solve problems such as trouble, burnout, short circuit, etc.

Inactive Publication Date: 2021-06-08
义乌市宜识贸易有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the current mainboard is used, due to the large number of hardware lines, it is easier to gather together due to the denser installation space, and the short circuit phenomenon will occur when the lines are gathered, and when the existing mainboard is used, the hardware will burn out due to long-term use. , and repair personnel need to check step by step, which is more troublesome. Therefore, we propose an intelligent motherboard that uses a spring structure to improve repair efficiency

Method used

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  • Intelligent mainboard for improving repair efficiency by using spring framework
  • Intelligent mainboard for improving repair efficiency by using spring framework
  • Intelligent mainboard for improving repair efficiency by using spring framework

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] see Figure 1-5 , an intelligent main board utilizing a spring structure to improve repair efficiency, comprising an intelligent main board 1, the left and right sides of the intelligent main board 1 are fixedly connected with mounting brackets 2, and the bottom of the mounting bracket 2 is movably connected with a telescopic movable frame 8 The left and right sides of the telescopic movable frame 8 are all movably connected with load springs 9, the lef...

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Abstract

The invention relates to the technical field of computer equipment, and provides an intelligent mainboard for improving repair efficiency by using a spring framework. The intelligent mainboard comprises an intelligent mainboard, the left and right sides of the intelligent mainboard are fixedly connected with mounting fixing frames, the center of the intelligent mainboard is movably connected with a central driving frame through the mounting fixing frames, and the upper side and the lower side of the intelligent mainboard are movably connected with movable frame bases through the mounting fixing frames. According to the intelligent mainboard for improving the repairing efficiency through a spring framework, when a computer is used, if the phenomenon that hardware is burnt out occurs, the heat dissipated by the hardware is high, air pipes on the inner sides of the fixed movable frames are expanded, a movable rod is pushed back by fixing a movable frame, an air bag expands to the left and right sides, the air bag drives a circuit of a socket, a connecting plug and a central plug in the closed state to move to the left and right sides, the movable frame bases are driven to stretch to the two sides through the mobility of a connecting rod, and the movable frame bases drive a movable connecting pipe to move to the two sides.

Description

technical field [0001] The invention relates to the technical field of computer equipment, in particular to an intelligent mainboard which uses a spring structure to improve repair efficiency. Background technique [0002] The computer is one of the indispensable tools in today's information society. It is composed of a hardware system and a software system. The main board is one of the main components of the computer. The device is engaged. [0003] When the current mainboard is used, due to the large number of hardware lines, it is easier to gather together due to the denser installation space, and the short circuit phenomenon will occur when the lines are gathered, and when the existing mainboard is used, the hardware will burn out due to long-term use. , and repair personnel need to check step by step, which is more troublesome. Therefore, we propose an intelligent motherboard that uses a spring structure to improve repair efficiency. Contents of the invention [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18G06F11/32
CPCG06F1/16G06F1/184G06F11/326
Inventor 肖泽鑫
Owner 义乌市宜识贸易有限公司
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