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Intelligent nail selection method and storage medium

A storage medium and intelligent technology, applied in the fields of instrumentation, computing, electrical and digital data processing, etc., can solve the problems of long time and complicated process of customizing the nail bed of the circuit board.

Active Publication Date: 2021-06-11
福建福强精密印制线路板有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Therefore, it is necessary to provide a new intelligent nail selection method to solve the complicated and time-consuming technical problems of circuit board nail bed customization in the prior art

Method used

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  • Intelligent nail selection method and storage medium

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Embodiment Construction

[0028] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0029] The bed of nails is made to jack up the board and level the surface, the surface needs to be printed with ink during work, there is pressure. The thinner the board is, the easier it is to collapse under pressure, so the thinner the board, the more nails are needed to support it below. The more nails, the smaller the distance between nails. The current process stipulates that the distance between the nails with a plate thickness of 1.6mm and above can be stressed at a distance of 50mm, while the distance between the nails for plates with a thickness of 1.0 to 1.2mm should be 30mm, and the distance between the nails for smaller plates such as 0.6 and 0.8mm should be 20mm. .

[0030] see below figure 1 , in order to meet the re...

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Abstract

The invention discloses an intelligent nail selection method and a storage medium, and the method comprises the following steps: newly building a first nail layer which comprises a first nail matrix arranged according to a preset gap in the transverse and longitudinal directions, calling circuit board film data, and aligning with the first nail layer, deleting overlapped sheet nails in the first nail layer within a preset distance range around elements of the circuit board film data to obtain a second sheet nail matrix; and continuously screening out the sheet nails in the second sheet nail matrix to obtain a third sheet nail matrix, so that the distance between any sheet nails in the third sheet nail matrix is greater than the preset nail distance. According to the technical scheme, an intelligent nail selection program is utilized, the chip nail layer is virtually generated in a computer, the repeated chip nails are deleted according to actual wiring, then the chip nails in the circle range are deleted according to the supporting requirement, and finally the chip nail data meeting the requirement is obtained.

Description

technical field [0001] The invention relates to a method for customizing a nail bed of a circuit board and a related storage medium. Background technique [0002] In the PCB manufacturing process, the bed of nails is used in the silk screen printing solder mask process: [0003] No bed of nails process: "plug hole → pre-baking → printing on one side of solder mask → pre-baking → printing on the second side of solder mask → pre-baking". [0004] Bed of nails process: "Plug hole → printed on one side of solder mask → printed on the second side of solder mask → pre-baking". [0005] The non-nail bed process requires pre-baking on each side of the solder mask printed. Using the nail bed process, the board after the printed hole can be supported to print the first side of the solder mask, and then turn the board over and use the nail bed to print the second side of the solder mask. , After printing all sides and then pre-baking. This shortens the overall process time. [0006...

Claims

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Application Information

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IPC IPC(8): G06F30/392G06F115/12
CPCG06F30/392G06F2115/12
Inventor 谢斯文许昌焰刘艺琼陈红华
Owner 福建福强精密印制线路板有限公司
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