Target material sputter coating device and use method thereof

Abstract

The invention relates to the technical field of target material sputter coating, and in particular relates to a target material sputter coating device and a use method thereof. The target material sputter coating device comprises a sealed box body; a coating cavity is formed in a negative pressure space; a target material base and a deposition substrate are arranged in the coating cavity; receiving and cleaning devices are arranged on the inner wall of the sealed box body; the receiving and cleaning devices each comprise a receiving and conveying belt, a target material scraping device and two rollers; the receiving and conveying belt is used for receiving particles flying to the inner wall of the sealed box body; the target material scraping device comprises a negative pressure suction and pickup nozzle and a scraper; the scraper is mounted in the suction and pickup nozzle; furthermore, a blade of the scraper is attached to the receiving and conveying belt; the negative pressure suction and pickup nozzle is used for sucking and picking up substances scraped by the scraper from the receiving and conveying belt; the number of the receiving and cleaning devices is four; the coating cavity is surrounded by the receiving and conveying belts of the four receiving and cleaning devices; the target material base and the deposition substrate are the same in shape and are rectangular; and the receiving and conveying belts of the four receiving and cleaning devices are attached to the four edges of the target material base / the deposition substrate respectively. According to the target material sputter coating device and the use method thereof in the invention, the coating cavity is surrounded by the receiving and conveying belts of the four receiving and cleaning devices; overflowing of bombarded target material particles is avoided as much as possible; and the cleaning degree is further improved.

Description

technical field [0001] The invention relates to the technical field of target material sputtering coating, in particular to a target material sputtering coating device and a method for using the same. Background technique [0002] Sputtering coating on the target is to use high-energy particles to bombard the target, so that the target particles are ejected from the target and deposited on the deposition substrate to form a film. The target and deposition substrate are basically installed in a vacuum chamber, or a negative pressure chamber, to improve processing quality. However, in the existing technology, the bombarded target particles will not only deposit on the deposition substrate to form a film, but also fly to the inner wall of the vacuum chamber to deposit a film. The film on the inner wall surface will accumulate to a certain extent and after a certain period of time Falling off and breaking into impurities seriously affects the processing quality of sputter coati...

AI Technical Summary

Problems solved by technology

However, in the existing technology, the bombarded target particles will not only deposit on the deposition substrate to form a film, but also fly to the inner wall of the vacuum chamber to deposit a film. The film on the inner wall surface will accumulate to a certain extent and after a certain period of time Falling off and breaking into impurities seriously affects the processing quality of sputter coating

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