Embedded optical character intelligent identification chip

Abstract

An embedded optical character intelligent identification chip disclosed in the invention comprises a bottom layer clamping piece, electronic connecting grooves are formed in the periphery of the upper end of the bottom layer clamping piece, a top layer clamping piece is arranged on the upper side of the bottom layer clamping piece, and butt joint grooves are formed in the periphery of the lower end of the top layer clamping piece; first bonding strips are arranged on the upper side of the bottom layer clamping piece and the lower side of the top layer clamping piece, a surrounding frame is arranged between the bottom layer clamping piece and the top layer clamping piece, second bonding strips are arranged at the upper end and the lower end of the surrounding frame, the first bonding strips are connected with the second bonding strips in a bonding mode, and electronic connectors are fixedly connected to the lower ends of the periphery of the surrounding frame; and the upper end of the periphery of the surrounding frame is fixedly connected with a butt joint, and the electronic connector is movably connected to the inner side of the electronic connecting groove. According to the embedded optical character intelligent identification chip, through an embedded installation mode, the contact surface between the chip and the external environment is reduced, and the adhesion between pollutants such as dust and the identification modules on the surface of the chip and in the chip is controlled to the maximum extent.

Description

technical field [0001] The invention relates to the technical field of chip equipment, in particular to an embedded optical character intelligent recognition chip. Background technique [0002] Compared with electronic chips such as CPUs, this optical chip executes artificial intelligence algorithms faster, and consumes less than one-thousandth of the energy consumption of traditional chips. Optical smart chips are the development trend of the electronics industry and will be in the market share in the future. occupies the vast majority of positions. [0003] After dirt or dust appears on the chip to be tested, the digital area of ​​the chip will stick. At this time, the calculation of the chip will "report an error". Obviously this is a misidentification, so the external protection of the chip can reduce this. In view of the occurrence of such misidentification, an embedded structure of a smart chip is now designed to facilitate the assembly of the device without causing a...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an embedded optical character intelligent recognition chip to solve the problem in the above-mentioned background technology that the optical chip is easily contaminated with dust during installation and leads to misidentification

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