Unlock instant, AI-driven research and patent intelligence for your innovation.

Welding method of circuit board and light-emitting device, display module, panel and solder

A technology of light-emitting device and welding method, applied in the field of display screen, can solve the problems of high refractive index and reflectivity, and achieve the effect of reducing power consumption and effective heat dissipation

Active Publication Date: 2022-04-19
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
View PDF17 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of this application is to provide a welding method for circuit boards and light-emitting devices, a display module, a panel and solder, aiming at solving the problem of the refractive index of PCB pads in LED display modules for light in related technologies, The problem with high reflectivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Welding method of circuit board and light-emitting device, display module, panel and solder
  • Welding method of circuit board and light-emitting device, display module, panel and solder
  • Welding method of circuit board and light-emitting device, display module, panel and solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0045] In the related art, the Mini-LED display module uses PCB as the circuit bo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention relates to a welding method for a circuit board and a light-emitting device, a display module, a panel and solder. A mixed structure of three-dimensional ordered colloidal crystals and nano-silver is set on the first pad of the circuit board, and the nano-silver is filled in the gap of the three-dimensional ordered colloidal crystal; the first pad is bonded to the second pad of the light-emitting device ; The mixed structure of three-dimensional ordered colloidal crystals and nano-silver is sintered. After the mixed structure of three-dimensional ordered colloidal crystals and nano-silver is sintered, the three-dimensional ordered colloidal crystals are ablated to form a three-dimensional ordered hole structure, and nano-silver is formed. The three-dimensional ordered nano-silver structure, the three-dimensional ordered nano-silver structure realizes the connection between the first pad and the second pad, thereby reducing the reflectivity and refractive index of the first pad on the circuit board to light; further, The three-dimensional ordered hole structure formed by the ablation of the three-dimensional ordered colloidal crystal can effectively dissipate heat from the circuit board and the light-emitting device, thereby reducing the power consumption of the display module.

Description

technical field [0001] The invention relates to the field of display screens, in particular to a welding method for a circuit board and a light-emitting device, a display module, a panel and solder. Background technique [0002] Mini Light Emitting Diode (Mini-LED) display is a new display technology based on inorganic semiconductor light-emitting diode (Light-emitting diode, LED), and the distance between lamp beads is between 0.6-1.2mm. Mini-LED display is used in Large-screen high-definition display, such as monitoring and command, high-definition studio, high-end cinema, medical testing and other professional fields or outdoor advertising, conferences and exhibitions, office display and other commercial fields. In the related technology, the Mini-LED display module uses a printed circuit board (Printed Circuit Board, PCB) as the circuit board, and the pads on the PCB will reflect and refract light, thereby affecting the vision of the Mini-LED display module. display eff...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/3447H05K3/3457H05K2203/04
Inventor 翟峰
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD