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High-precision alignment follow-up self-adaptive floating suction head

An adaptive and high-precision technology, applied in workpiece clamping devices, manufacturing tools, etc., can solve problems such as difficulty in meeting the testing requirements of tiny chips and high-density pins, achieve strong adaptive compatibility, high precision, and meet high pressure The effect of the test

Active Publication Date: 2021-06-18
天津金海通半导体设备股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention aims to propose a high-precision alignment and follow-up adaptive floating suction head to solve the problem that the existing packaging and testing equipment is difficult to meet the testing requirements of tiny chips and high-density pins

Method used

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  • High-precision alignment follow-up self-adaptive floating suction head
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  • High-precision alignment follow-up self-adaptive floating suction head

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Embodiment Construction

[0031] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0032] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus should not be construed as limiting the invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only, and should not be understood ...

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Abstract

The invention provides a high-precision alignment follow-up self-adaptive floating suction head. According to the high-precision alignment follow-up self-adaptive floating suction head, the upper end of a fixing block is located in a pressure bearing block, the pressure bearing block and the fixing block move relatively, the two sides of the fixing block are fixedly installed on external equipment, the pressure bearing block is located between the fixing block and the external equipment, a first mounting hole is formed in the middle of an air path block, the periphery of the lower end of the fixing block is located in the first mounting hole, one side of the air path block is provided with an air connector, the upper end of a suction rod is clamped into the fixing block, the lower end of the suction rod penetrates through the first mounting hole and then is fixedly connected to the upper end of the suction head, the lower end of the suction head sequentially penetrates through a base and a cover plate and then is in contact connection with a chip, and two ends of the base are fixedly connected to the lower end of the air path block and the upper end of the cover plate correspondingly. According to the high-precision alignment follow-up self-adaptive floating suction head, in the material suction process, the situation that the chip is impacted by device movement can be prevented, the positioning precision is high, and the device is wide in chip compatibility range, meets the requirement for large-pressure testing and is high in self-adaptive compatibility.

Description

technical field [0001] The invention belongs to the field of IC test equipment, and in particular relates to a high-precision alignment and self-adaptive floating suction head. Background technique [0002] At present, the vigorous packaging and testing market demand puts forward new requirements for the equipment of packaging and testing companies, which can meet the testing needs of micro chips and high-density pins. However, the existing packaging and testing equipment is difficult to meet the testing requirements of tiny chips and high-density pins. The main reason is that the old packaging and testing equipment has poor automatic performance, and generally uses manual or semi-automatic devices, which are difficult to meet the needs of high precision, automation, high pressure, and wide variety. Existing mechanisms use pins, auxiliary rails, etc. to complete. These methods are prone to parts wear, large assembly errors, small degrees of freedom of parts, and certain li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B25B11/00
CPCB25B11/005
Inventor 杨文宝崔学峰仇葳贺怀珍吕克振孟飞沈程
Owner 天津金海通半导体设备股份有限公司