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Circuit board inspection method and device

An inspection method and circuit board technology, applied to measuring devices, instruments, etc., can solve the problems of poor accuracy, easy missed inspection, low efficiency, etc., and achieve the effect of accurate inspection results and high inspection efficiency

Inactive Publication Date: 2021-06-18
SHANGHAI WINGTECH INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This inspection method is inefficient and easy to miss, resulting in poor accuracy

Method used

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  • Circuit board inspection method and device
  • Circuit board inspection method and device
  • Circuit board inspection method and device

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Embodiment Construction

[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments It is a part of the embodiments of the present disclosure, but not all of them. The components of the disclosed embodiments generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0045] Accordingly, the following detailed description of the embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary sk...

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Abstract

The invention provides a circuit board inspection method and device, and relates to the field of circuit boards. The circuit board inspection method comprises the following steps: traversing a first surface of a target part of a circuit board to obtain position information of a first area covered by bonding pads connected with all BGA devices on the first surface of the target part; traversing a second surface of the target part of the circuit board to obtain position information of a second area covered by all the shielding ribs on the second surface of the target part; and judging whether the first area and the second area have an overlapped part in the thickness direction of the circuit board, and if yes, outputting prompt information. Through adoption of the checking method disclosed by the invention, if overlapping is checked out, the prompt information can be output in time, so that a designer can rectify a design scheme in time. The checking method can be realized by running the script in the software, observation and judgment completely relying on human eyes are avoided, and the checking method has the advantages of being efficient and accurate. The circuit board inspection device disclosed by the invention is used for realizing the circuit board inspection method.

Description

technical field [0001] The present disclosure relates to the field of circuit boards, in particular, to a circuit board inspection method and device. Background technique [0002] Mounting components on the surface of a circuit board may subject the board to mechanical and thermal stresses that may cause the board to warp, affect its performance and even cause the board to fail. Therefore, the arrangement of devices on the circuit board needs to be reasonably designed. The design stage of the circuit board is completed by software, and the designer constructs the model (graphics) of the circuit board through the software. Usually, designers judge the rationality of the design by visually observing the devices on both sides of the circuit board model, such as whether the designed circuit board is prone to obvious stress problems during production and use. This inspection method is inefficient and easy to miss, resulting in poor accuracy. Contents of the invention [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B21/08G01B21/02
CPCG01B21/08G01B21/02
Inventor 吴发用
Owner SHANGHAI WINGTECH INFORMATION TECH CO LTD
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