Conductive Interconnects and Methods of Forming Conductive Interconnects

Abstract

The invention relates to conductive interconnects and methods of forming conductive interconnects. Some embodiments include an integrated assembly having an interconnect over a first conductive structure and coupled with the first conductive structure. The interconnect includes a conductive core. The conductive core has a slender upper region and a wide lower region. The upper region joins to the lower region at a step. A liner laterally surrounds the lower region of the conductive core. The liner has an upper surface which is substantially coplanar with the step. An insulative collar is over and directly against both an upper surface of the step and the upper surface of the liner. The insulative collar laterally surrounds and directly contacts the slender upper region. A second conductive structure is over and directly against a region of the insulative collar, and is over and directly against an upper surface of the slender upper region. Some embodiments include methods of forming integrated assemblies.

Description

technical field [0001] The present invention relates to integrated assemblies, memory arrays, conductive interconnects, and methods of forming conductive interconnects. Background technique [0002] Memory is often incorporated into integrated circuits. Memory can be used, for example, in a computer system to store data. [0003] Memory can be provided as large arrays of memory cells. Word lines (access lines) and bit lines (digit lines, sense lines) can be provided across the entire array such that individual memory cells are uniquely addressable by a combination of word lines and bit lines. [0004] Conductive interconnects can be used to electrically couple from lower-level circuitry to higher-level circuitry; and in some embodiments, can be used to couple wordlines to control circuitry (e.g., driver circuitry) and / or for The bit lines are coupled with sensing circuitry (eg, sense amplifier circuitry). [0005] A continuing goal of integrated circuit fabrication is to...

AI Technical Summary

Problems solved by technology

However, as the level of integration increases, problems may arise that cause one or both of the conductive lines 308a and 308c to short the interconnect 302

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