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Water-based formaldehyde-free adhesive for flame-retardant composite board and preparation method thereof

An aldehyde adhesive and water-based technology, which is applied in the field of water-based aldehyde-free adhesives for flame retardant composite panels and their preparation, can solve the problems of physical damage, rapid spread, and unimaginable consequences, and can reduce the concentration and enhance the stretching. The effect of strength and wear resistance

Active Publication Date: 2022-04-26
上海德万家企业发展(集团)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, plywood is widely used in daily life. There are plywood everywhere in floor boards, ceilings, furniture, and decoration materials. The use of plywood is inseparable from adhesives, and most of the adhesives on the market are phenolic adhesives. Over time, formaldehyde will be released slowly, causing considerable damage to the human body. At the same time, there are many problems with water-based adhesives on the market, among which water resistance is the biggest problem.
[0003] At the same time, plywood is a flammable material. Once it catches fire, the fire will spread rapidly and the consequences will be unimaginable. Therefore, in order to solve the above problems, the present invention proposes a water-based formaldehyde-free adhesive for flame-retardant composite boards and its preparation method

Method used

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  • Water-based formaldehyde-free adhesive for flame-retardant composite board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A method for preparing a water-based formaldehyde-free adhesive for a flame-retardant composite board, comprising the following steps:

[0043] S1: reacting aluminum nitrate nonahydrate with sodium fumarate to prepare a fumaric acid-aluminum complex;

[0044] S2: Preparation of network polyurethane, coated with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide to obtain 9,10-dihydro-9-oxa-10-phospha Phenanthrene-10-oxide complex;

[0045] S3: reacting soybean polysaccharide with isocyanate to prepare microencapsulated isocyanate;

[0046] S4: Mix fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate and defatted soy flour to prepare adhesive agent.

[0047] Among them, S1:

[0048] Mix aluminum nitrate nonahydrate with deionized water, heat in a water bath to 30°C, stir for 10 minutes, add sodium fumarate, heat in a water bath to 45°C, stir for 20 minutes, ultrasonically oscillate for 20 minutes, fil...

Embodiment 2

[0056] A method for preparing a water-based formaldehyde-free adhesive for a flame-retardant composite board, comprising the following steps:

[0057] S1: reacting aluminum nitrate nonahydrate with sodium fumarate to prepare a fumaric acid-aluminum complex;

[0058] S2: Preparation of network polyurethane, coated with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide to obtain 9,10-dihydro-9-oxa-10-phospha Phenanthrene-10-oxide complex;

[0059] S3: reacting soybean polysaccharide with isocyanate to prepare microencapsulated isocyanate;

[0060] S4: Mix fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate and defatted soy flour to prepare adhesive agent.

[0061] Among them, S1:

[0062] Mix aluminum nitrate nonahydrate with deionized water, heat in a water bath to 30°C, stir for 15 minutes, add sodium fumarate, heat in a water bath to 45°C, stir for 25 minutes, ultrasonically oscillate for 25 minutes, fil...

Embodiment 3

[0070] A method for preparing a water-based formaldehyde-free adhesive for a flame-retardant composite board, comprising the following steps:

[0071] S1: reacting aluminum nitrate nonahydrate with sodium fumarate to prepare a fumaric acid-aluminum complex;

[0072] S2: Preparation of network polyurethane, coated with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide to obtain 9,10-dihydro-9-oxa-10-phospha Phenanthrene-10-oxide complex;

[0073] S3: reacting soybean polysaccharide with isocyanate to prepare microencapsulated isocyanate;

[0074] S4: Mix fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate and defatted soy flour to prepare adhesive agent.

[0075] Among them, S1:

[0076] Mix aluminum nitrate nonahydrate with deionized water, heat in a water bath to 30°C, stir for 20 minutes, add sodium fumarate, heat in a water bath to 45°C, stir for 30 minutes, ultrasonically oscillate for 30 minutes, fil...

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Abstract

The invention discloses a water-based formaldehyde-free adhesive for a flame-retardant composite board and a preparation method thereof. The adhesive is mainly made of fumaric acid-aluminum complex, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide complex, microencapsulated isocyanate, defatted soybean powder; high temperature When burning, defatted soy flour decomposes to produce isocyanate and polyurethane decomposes to produce isocyanate and fumaric acid to form imine structure, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide and phosphaphenanthrene-10-oxide The amine structure undergoes an addition reaction to produce nitrogen-containing compounds. The nitrogen-containing compounds thermally decompose during combustion to produce ammonia inert gas, which reduces the concentration of combustible gases and the combustion rate. The nitrogen-containing compounds burn to form a carbon layer, which reduces molten droplets and improves flame retardancy. . The adhesive prepared by the present invention has improved water resistance on the basis of water-based adhesives, does not contain aldehyde groups, does not release formaldehyde to pollute the environment, and has good flame retardancy, which can effectively slow down the burning rate of the composite board. It has high practicality and production value.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a water-based formaldehyde-free adhesive for flame-retardant composite boards and a preparation method thereof. Background technique [0002] At present, plywood is widely used in daily life. There are plywood everywhere in floor boards, ceilings, furniture, and decoration materials. The use of plywood is inseparable from adhesives, and most of the adhesives on the market are phenolic adhesives. Over time, formaldehyde will be released slowly, causing considerable damage to the human body. At the same time, there are many problems with water-based adhesives on the market, among which water resistance is the biggest problem. [0003] At the same time, plywood is a flammable material. Once it catches fire, the fire will spread rapidly and the consequences will be disastrous. Therefore, in order to solve the above problems, the present invention proposes a water-based formaldehyde...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J189/00C09J11/06
CPCC09J189/00C09J11/06C08K5/0091C08K9/10C08K5/29C08K5/5313
Inventor 王德胜
Owner 上海德万家企业发展(集团)有限公司
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