High-strength silver-free copper-based brazing filler metal

[0016] In order to make it easy to understand the technical means, creative features, goals and effects achieved by the present invention, the present invention will be further explained in conjunction with specific embodiments below.

[0017] A high-strength silver-free copper-based solder is composed of the following components by mass percentage:

[0018] P: 5%

[0019] Sn: 1-4%

[0020] Ni: 1-2%

[0021] The remainder is Cu.

[0022] The preferred mass percentage of each component is:

[0023] P: 5%

[0024] Sn: 4%

[0025] Ni: 1%

[0026] The remainder is Cu.

[0027] A high-strength silver-free copper-based solder with low cost, safety and environmental protection, and good welding effect. By adding Sn and Ni, the melting point of the solder alloy is reduced, and the tensile strength and wettability of the solder alloy are enhanced.

[0028] The basic principles and main features and advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the foregoing embodiments. The foregoing embodiments and descriptions only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have Various changes and improvements, these changes and improvements all fall within the scope of the claimed invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.