High-strength silver-free copper-based brazing filler metal
By using a combination of phosphorus, tin and nickel in the solder, the problems of high cost and environmental pollution of the existing solder are solved, and low-cost, high-strength and environmentally friendly welding effects are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ANHUI HUAZHONG WELDING MATERIAL CO LTD
- Filing Date
- 2015-05-19
- Publication Date
- 2015-09-09
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When existing solders are welded between dissimilar metals such as copper, stainless steel, stainless iron, and copper alloys, it is often necessary to use precious metal Ag-based or cadmium-containing silver-based solders, resulting in high costs, environmental pollution, and human body toxicity, which limits the Application of welding technology.
A silver-free copper-based solder composed of phosphorus (P), tin (Sn) and nickel (Ni) is used. By adjusting the component ratio, the melting point of the solder alloy is reduced and the tensile strength and wetting properties are improved.
A low-cost, safe and environmentally friendly high-strength welding effect is achieved. The addition of Sn and Ni enhances the tensile strength and wetting properties of the solder.