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Comprehensive test equipment for discrete device series

A technology of discrete devices and test equipment, which is applied to parts, instruments, and measuring devices of electrical measuring instruments. It can solve problems such as slipping of discrete devices and affecting the accuracy of discrete devices, and achieve slip prevention, fast and convenient fixed clamping , improve the effect of the effect

Inactive Publication Date: 2021-07-16
陕西三海电子科技有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the prior art does not have the function of fixing and clamping the discrete device, so it is easy to cause the discrete device to slip during the test, which affects the accuracy of the discrete device test, so it cannot satisfy people. The issue of the need for a comprehensive test facility for the proposed family of discrete devices

Method used

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  • Comprehensive test equipment for discrete device series
  • Comprehensive test equipment for discrete device series
  • Comprehensive test equipment for discrete device series

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0023] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0024] refer to Figure ...

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Abstract

The invention relates to the technical field of test equipment, and discloses comprehensive test equipment for a discrete device series. The comprehensive test equipment comprises an upper box body, wherein two lower box bodies are fixedly installed at the bottom part of the upper box body, push rod motors are fixedly installed on the inner walls of the tops of the lower box bodies, telescopic rods are fixedly installed on output shafts of the push rod motors, a connecting plate is fixedly installed at the top part of each telescopic rod, connecting holes are formed in each connecting plate, connecting rods are slidably installed in the two connecting holes, and the bottom ends of the two connecting rods extend to the position below each connecting plate and are fixedly provided with first pressing plates. The comprehensive test equipment is simple in structure and convenient to operate, discrete devices can be quickly and conveniently fixed and clamped, sliding is prevented when the discrete devices are tested, the effect of testing the discrete devices is improved, and therefore the requirements of people are met.

Description

technical field [0001] The invention relates to the technical field of testing equipment, in particular to a series of comprehensive testing equipment for discrete devices. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, diodes, resistors, capacitors, inductors and other components required in a circuit are interconnected together, fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. Inside the shell, it becomes a microstructure with the required circuit functions; integrated circuit boards can be divided into two categories: analog integrated circuit boards and digital according to their functions and structures. According to the manufacturing process, they can be divided into semiconductors and thin films. According to the level of integration, it can be divided into small-scale, medium-scale, large-scale and ultra-large-sca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
CPCG01R1/0408
Inventor 裘卓敏
Owner 陕西三海电子科技有限公司
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