Unlock instant, AI-driven research and patent intelligence for your innovation.

Electronic component

A technology of electronic components and components, applied in the field of electronic components

Pending Publication Date: 2021-07-20
TDK CORPARATION
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, it is not easy to fix the electronic component in which the chip component is accommodated in the case to the mounting portion as described above.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic component
  • Electronic component
  • Electronic component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0114] like Figure 1A As shown, the electronic component 10 according to the first embodiment of the present invention includes two capacitor chips (chip components) 20a and 20b, a plurality of conductive terminals, insulating cases 60_1 to 60_3, and a fixing portion. In the present embodiment, the electronic component 10 includes individual metal terminals 30a and 30b, common metal terminals 40a and 40b, and connection metal terminals 50a and 50b as conductive terminals. In addition, in the present embodiment, the housings 60_2 and 60_3 and the individual metal terminals 30a and 30b are provided with fixing portions. Details of the conductive terminal and the fixing portion will be described later.

[0115] The capacitor chips 20a and 20b are each substantially in the shape of a rectangular parallelepiped, and have substantially the same shape and size as each other. like Figure 4 As shown, the capacitor chips 20a and 20b each have an element body in which the internal el...

no. 2 approach

[0203] 5A to 8The electronic component 10A of the illustrated embodiment has the same configuration as the electronic component 10 of the first embodiment except for the points shown below, and can achieve the same functions and effects. exist 5A to 8 Among them, the same reference numerals are attached to the components common to the components in the electronic component 10 of the first embodiment, and a part of the description thereof is omitted.

[0204] The electronic component 10A differs from the electronic component 10 of the first embodiment in that it has an insulating case 60A_2, a second individual metal terminal 30bA, and a third connection metal terminal 50c. Compared Image 6 and Figure 2C It can be seen that the insulating case 60A_2 is different from the insulating case 60_2 of the first embodiment in that the engaging groove 660 is formed in the vicinity of the boundary between the opening creeper 66 and the case side portion 670 . That is, in the pres...

no. 3 approach

[0216] Figure 9 to Figure 11 The electronic component 10B of the illustrated embodiment has the same configuration as the electronic component 10 of the first embodiment except for the points shown below, and can achieve the same functions and effects. exist Figure 9 to Figure 11 In the figure, the same reference numerals are attached to the components common to the components of the electronic component 10 according to the first embodiment, and a part of the description thereof will be omitted. Furthermore, in Figure 9 , the illustration of the mounting portion 80 is omitted.

[0217] The electronic component 10B has a connected body of the two insulating cases 60_1 and 60_1 and the insulating case 60B_1. like Figure 10A and Figure 10B As shown, the insulating case 60B_1 has an engaging groove 660B. The engaging groove 660B is formed so as to span from the side of the outer side surface 61 a to the side of the outer side surface 61 d along the opening creep surface...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an electronic component which can be easily fixed at a desired position of an installation portion. The electronic component (10) includes a chip component (20a, 20b), a conductive terminal (30, 40, 50), a case (60_1, 60_2, 60_3), and a fixation part (a terminal side fixation part (36) and a case side fixation part (67)). The chip component includes a terminal electrode (20a, 20b) on an end surface of the chip component. The conductive terminal is connected to the terminal electrode (22, 24). The case includes an accommodation recess (62a, 62b) for accommodating the chip component (20a, 20b). The fixation part fixes the case(60_1, 60_2, 60_3) to an installation portion (80).

Description

technical field [0001] The present invention relates to an electronic component having a case that houses a chip component such as a laminated ceramic capacitor. Background technique [0002] As electronic components such as multilayer ceramic capacitors, in addition to general electronic components in which a chip component is directly surface mounted on a substrate or the like as a single body, as shown in Patent Document 1, for example, a structure in which the chip component is housed in a case is also known. electronic components. [0003] It is reported that such an electronic component has the effect of protecting the chip component from shock or the like after being mounted, and is used in fields requiring durability, reliability, and the like. [0004] However, for example, when configuring a power supply circuit, a filter module or the like may be formed of a chip component or the like, and the filter module or the like may be assembled and fixed inside a frame or...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/224H01G4/30H01G4/12
CPCH01G4/224H01G4/30H01G4/12H01G2/065H01G4/228H01G2/106H01G2/06H01G4/40
Inventor 增田朗丈伊藤信弥安藤德久矢泽广祐佐藤佳树小林一三宇津井浩二金子浩二
Owner TDK CORPARATION