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External packaging structure, MEMS sensor and electronic equipment

An external packaging and sensor technology, applied in the field of sensors, can solve problems such as increased deformation and affect the output accuracy of MEMS sensors, and achieve the effects of reducing deformation stress, improving flatness, and improving output accuracy

Pending Publication Date: 2021-07-23
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the circuit board will inevitably be deformed due to packaging process steps such as cutting, baking, etc., and the failure to release the deformation stress will further lead to increased deformation, thereby affecting the output accuracy of the MEMS sensor

Method used

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  • External packaging structure, MEMS sensor and electronic equipment
  • External packaging structure, MEMS sensor and electronic equipment
  • External packaging structure, MEMS sensor and electronic equipment

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, in t...

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Abstract

The invention discloses an external packaging structure, an MEMS sensor applying the external packaging structure and electronic equipment applying the MEMS sensor. The external packaging structure comprises a circuit board, the circuit board is provided with a device installation surface, the device installation surface is provided with a packaging area, and the outer sides of the four corners of the packaging area are each provided with a stress concentration hole. According to the technical scheme of the invention, the deformation of the circuit board caused by cutting, baking and the like in the packaging process steps can be improved, so the output precision of the MEMS sensor is improved.

Description

technical field [0001] The invention relates to the field of sensors, in particular to an external packaging structure, a MEMS sensor using the external packaging structure and electronic equipment using the MEMS sensor. Background technique [0002] In recent years, with the rapid development of science and technology, Micro-Electro-Mechanical System (MEMS) emerges as the times require. Among them, MEMS sensors, as detection devices, have been widely used in electronic devices such as mobile phones, notebook computers, tablet computers, and wearable devices. [0003] Currently, most MEMS sensors use circuit boards as packaging substrates to implement packaging of devices such as MEMS chips and ASIC chips. However, the circuit board will inevitably be deformed due to packaging process steps such as cutting, baking, etc., and the failure to release the deformation stress will further lead to increased deformation, thereby affecting the output accuracy of the MEMS sensor. C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02
CPCB81B7/0045B81B7/02B81B2201/02
Inventor 刘兵朱恩成陈磊张强
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD