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Ejector pin mechanism and degassing chamber

A gas chamber and thimble technology, applied in the field of degassing chambers, can solve the problems of wafer 300 breaking and wafer 300 collision, etc.

Pending Publication Date: 2021-07-23
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the wafer 300 is offset, the platform manipulator will easily collide with the wafer 300 when entering the degassing chamber, and may break the wafer 300

Method used

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  • Ejector pin mechanism and degassing chamber
  • Ejector pin mechanism and degassing chamber
  • Ejector pin mechanism and degassing chamber

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Embodiment Construction

[0047] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0048] As an aspect of the present invention, such as Figure 4 and Figure 7As shown, a thimble mechanism for a degassing chamber is provided, the degassing chamber includes a heating element for carrying and heating a wafer during the degassing process, and the thimble mechanism is used for lifting the wafer from the heating element Or place the wafer on the heating element.

[0049] As a specific implementation mode, the wafer is used as the object to be loaded. The ejector pin mechanism of this embodiment includes a plurality of ejector pins 203, a lifting bracket 202 and a lifting device 201, and a plurality of ejector pins 203 are arranged on the lifting...

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PUM

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Abstract

The invention provides an ejector pin mechanism for a degassing chamber. The ejector pin mechanism comprises a plurality of ejector pins, a lifting bracket and a lifting device, wherein the output shaft of the lifting device is connected with the lifting bracket, the plurality of ejector pins are arranged on the lifting bracket at intervals, the lifting device is used for driving the ejector pins to do lifting motion, and each ejector pin comprises a supporting part extending towards the middle of the lifting bracket and a limiting part extending upwards. The invention also provides a degassing chamber. According to the invention, the ejector pins comprise the limiting parts, so that when the ejector pins jack up the wafer arranged on the heating piece, the wafer is limited in the area jointly limited by the limiting parts of the ejector pins and is jointly supported by the supporting parts of the ejector pins, the wafer cannot slide off from the ejector pins, and the position cannot deviate so as to avoid the risk that the wafer is broken by the manipulator.

Description

[0001] This application is a divisional application of an invention patent application with an application date of January 28, 2015, an application number of 201510045397.0, and an invention title of "thimble mechanism and degassing chamber". technical field [0002] The invention relates to the field of semiconductor processing equipment, in particular to a thimble mechanism and a degassing chamber including the thimble mechanism. Background technique [0003] When etching or deposition processes are performed on the wafer, it is necessary to degas the wafer first. Specifically, the wafer is placed in a degassing chamber, and then the wafer is heated to a predetermined temperature (usually 350° C.) to remove water vapor and other volatile impurities on the wafer. After degassing, the semiconductor substrate can be taken out of the degassing chamber by a robot. [0004] figure 1 Shown in is a schematic diagram of a common degassing chamber, such as figure 1 As shown in , ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
Inventor 张伟邱国庆李强
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD