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Light-emitting device

A technology for a light-emitting device and a light-emitting module, which is applied in the directions of identification devices, lighting devices, light sources, etc., can solve the problems of lowering the manufacturing yield of the light-emitting device and the like

Pending Publication Date: 2021-07-23
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to increase the number of light-emitting diodes on the light-emitting device, the manufacturing yield of the light-emitting device is reduced

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] figure 1 It is a light emitting device of an embodiment of the present invention. The light-emitting device is, for example, a backlight module using a light-emitting diode (Light-Emitting Diode; LED) chip and / or a light-emitting diode package and / or a light-emitting diode chip-scale package (ChipScale Package; CSP) as a light-emitting element. Figure 2A ~ Figure 2F , Figure 3A ~ Figure 3B The manufacturing method of an embodiment of the present invention can assemble a plurality of light-emitting modules into a light-emitting device.

[0038] refer to figure 1 , the light-emitting device 10000 includes a first light-emitting module 1000 and a second light-emitting module 2000, the first light-emitting module 1000 and the second light-emitting module 2000 are electrically connected through a conductive layer 300, and are mechanically connected through an insulating layer 400 to improve bonding Strength of. The first light-emitting module 1000 includes a first subs...

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PUM

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Abstract

A light-emitting device is disclosed, and includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.

Description

technical field [0001] The invention relates to a light-emitting device combined with several light-emitting modules and a manufacturing method thereof, in particular to a light-emitting device spliced ​​with several glass substrates and a manufacturing method thereof. Background technique [0002] In order to improve the bright contrast of the display screen, the technique of local dimming is gradually applied to various light emitting devices used as displays. However, in order to realize the technology of area lighting, it is necessary to increase several times of light-emitting diodes on the light-emitting device. However, in order to increase the number of light emitting diodes on the light emitting device, the manufacturing yield of the light emitting device is reduced. [0003] In order to improve the manufacturing yield, the light emitting device can be spliced ​​by sub-light emitting modules with smaller size but higher yield. The number of light-emitting diodes o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/62G09F9/33
CPCH01L25/0753H01L33/62G09F9/33H01L25/167F21V23/005F21Y2115/10
Inventor 谢明勋苏英阳廖世安刘欣茂王子翔蒲计志
Owner EPISTAR CORP