MMC five-level half-bridge anti-series submodule FLHASM topological structure

A topology and sub-module technology, applied in electrical components, output power conversion devices, and AC power input to DC power output, etc., can solve the immature manufacturing process, limit the development and application of flexible DC, and limit the use of overhead lines. And other issues

Pending Publication Date: 2021-07-30
KUNMING UNIV OF SCI & TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on the above reasons, many flexible DC transmission projects can only choose expensive DC cables to reduce the probability of DC side faults, thus limiting the use of relatively economical overhead lines
At the same time, due to the immature manufacturing process of high-voltage and large-capacity DC circuit breakers, the existing multi-terminal flexible DC power transmission projects also require DC cables to have extremely high reliability to reduce the probability of DC side faults, which limits the flexibility to a certain extent. Development and Application of DC to Multi-terminal DC Transmission Field

Method used

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  • MMC five-level half-bridge anti-series submodule FLHASM topological structure
  • MMC five-level half-bridge anti-series submodule FLHASM topological structure
  • MMC five-level half-bridge anti-series submodule FLHASM topological structure

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Embodiment 1

[0045] Embodiment 1: as figure 1 As shown, a MMC five-level half-bridge anti-series sub-module FLHASM topology includes an MMC sub-module topology, and the MMC sub-module topology includes a sub-module output terminal, and the sub-module output terminal is a voltage positive output terminal and a negative pole At the output end, the sub-module topology also includes a left half and a right half. The left half is composed of two traditional half-bridge sub-modules (HBSM) connected in reverse series, and the right half is composed of two reversed half-bridge sub-module through a power device group T 7 and D 7 connection, the two parts are passed through a high-power diode D 10 Connected to form a complete sub-module topology.

[0046] T 1 ,T 2 ,T 3 ,T 4 ,D 1 ,D 2 ,D 3 ,D 4 and C 1 , C 2 A group constitutes the left half of the submodule, T 5 ,T 6 ,T 7 ,T 8 ,T 9 ,D 5 ,D 6 ,D 7 ,D 8 ,D 9 and C 3 , C 4 Form the right half of the submodule for the other grou...

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Abstract

The invention relates to an MMC five-level half-bridge anti-series submodule FLHASM topological structure, and belongs to the technical field of flexible direct current power transmission. The structure comprises an MMC sub-module topology, the MMC sub-module topology comprises sub-module output ends, the sub-module output ends are a voltage positive electrode output end and a voltage negative electrode output end, the sub-module topology further comprises a left half part and a right half part, the left half part is formed by reversely connecting two half-bridge sub-modules in series, and the right half part is a complete sub-module topological structure formed by connecting two reverse half-bridge sub-modules through a power device group T7 and a power device group D7 and then connecting the two parts through a high-power diode D10. Compared with a full-bridge sub-module outputting the same level number, the five-level half-bridge anti-series MMC sub-module has the advantages that the number of switching tubes used by the five-level half-bridge anti-series MMC sub-module is greatly reduced, and the five-level half-bridge anti-series MMC sub-module has better direct-current fault clearing capability.

Description

technical field [0001] The invention relates to a MMC five-level half-bridge anti-series sub-module FLHASM topology, in particular to a modular multilevel converter (Modular Multilevel Converter, MMC) five-level half-bridge anti- The series sub-module FLHASM topology belongs to the technical field of flexible direct current transmission. Background technique [0002] Due to the modular design of the Modular Multilevel Converter (MMC), flexible changes in voltage and power levels can be achieved by adjusting the number of sub-modules in series, and can be extended to any level of output, thus The problem of electromagnetic interference and high harmonic content of the output voltage of traditional two-level and three-level voltage source converters is solved. The HVDC technology based on the modular multilevel converter (MMC) has broad application prospects in many fields such as new energy access, power supply to passive grids, asynchronous grid interconnection, and urban d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/483H02M7/5387H02M1/32
CPCH02M7/483H02M7/53875H02M1/32
Inventor 束洪春王文韬江耀曦邵宗学包广皎田鑫萃
Owner KUNMING UNIV OF SCI & TECH
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