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Method for machining surface micro-grooves, and micro-EDM device

A processing method and micro-groove technology, applied in attachments, metal processing equipment, electric processing equipment, etc., can solve the problem of difficulty in removing debris, and achieve the effect of high-quality, high-efficiency micro-EDM machining

Active Publication Date: 2022-07-26
SHENZHEN UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] In view of this, the embodiment of the present application provides a method for processing micro-grooves on the surface and a micro-EDM device, one of the purposes of which is to solve the problem that it is difficult to remove debris during the micro-EDM process

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  • Method for machining surface micro-grooves, and micro-EDM device
  • Method for machining surface micro-grooves, and micro-EDM device
  • Method for machining surface micro-grooves, and micro-EDM device

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Embodiment Construction

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0034] It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inside", "outside", etc. indicate t...

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Abstract

A method for processing surface micro-grooves, and a micro-EDM device. First, an array groove channel is formed on a first metal foil, the first metal foil and the second metal foil are alternately laminated and combined to form an initial laminated electrode, and the second The EDM loss rate of the second metal foil is smaller than the EDM loss rate of the first metal foil. The initial laminated electrode is processed according to a preset path to form a laminated electrode blank, and the laminated electrode blank is fixed in the gas storage device. , and the gas is input from the gas inlet of the gas storage device, and the gas is output from the gas outlet of the gas storage device and the array groove channel. The working end face is gradually worn out to form a preset contour structure, and then it is used for micro-EDM machining, so as to realize high-quality and high-efficiency micro-EDM machining of deep and narrow micro-grooves, and solve the difficulty of chip removal in the process of micro-EDM machining. bigger problem.

Description

technical field [0001] The application belongs to the technical field of electric discharge machining, and in particular relates to a method for machining surface micro-grooves and a micro electric discharge machining device. Background technique [0002] Surface microgrooves are an important surface functional structure, and cutting, grinding, laser machining, electrolytic machining and electrical discharge machining are typical processing methods to obtain surface microgrooves. Laser processing is difficult to machine deep and narrow microgrooves due to focusing problems; electrolytic machining is difficult to control dimensional accuracy due to stray corrosion; cutting / grinding processing can obtain high-quality machined surfaces, but it is difficult to machine deep and narrow microgrooves. As a kind of EDM, compared with other processing methods, micro-EDM has the advantages of non-contact, no macro cutting force, and can process any high-strength, high-hardness conducti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H1/00B23H11/00
CPCB23H1/00B23H11/00
Inventor 雷建国伍博何振业伍晓宇徐斌赵春洋
Owner SHENZHEN UNIV
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