Machine for feeding, cover adding, discharging and cover removing of semiconductor substrate

A semiconductor and substrate technology, applied in the field of cover replacement structure, can solve problems such as chip scrapping

Active Publication Date: 2021-08-06
上海世禹精密机械有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problem that the chip is washed out of the tray when the chip is washed with water and the chip is scrapped, the invention provides a machine for loading, capping, unloading, and removing the cover of the semiconductor substrate

Method used

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  • Machine for feeding, cover adding, discharging and cover removing of semiconductor substrate
  • Machine for feeding, cover adding, discharging and cover removing of semiconductor substrate
  • Machine for feeding, cover adding, discharging and cover removing of semiconductor substrate

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see Figure 1-3 , a kind of semiconductor substrate loading and unloading machine of the present invention includes a loading part 100, a water washing machine 200 and a feeding part 300, and the front and rear of the washing machine 200 are respectively connected with the feeding part 100 and the unloading part 300 connections.

[0021] The feeding part includes a material box feeding conveyor belt 101, a material box jaw 102, a push rod 103, a tray p...

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PUM

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Abstract

The invention discloses a machine for feeding, cover adding, discharging and cover removing of a semiconductor substrate. The machine comprises a feeding part, a washing machine and a discharging part, wherein the front part and the rear part of the washing machine are connected with the feeding part and the discharging part respectively; and the feeding part comprises a material box feeding conveying belt, a material box clamping jaw, a push rod, a supporting plate positioning rail, a cover plate feeding area, a cover plate adsorption area and a first material distribution guide rail, and the discharging part comprises a washing flow channel, a second material distribution guide rail, a positioning guide rail, a cover plate discharging area, a material box discharging area, a cover plate adsorption mechanism, a push rod part and a material box clamping part. On the basis of a common feeding machine, the function of additionally arranging a cover plate on a supporting plate is added, the function of preventing the situation of chips from being flushed out of the supporting plate by water flow and causing chip scrapping is achieved, and the supporting plate is positioned on the guide rails, so that the situation that the when the supporting plate deforms, the supporting plate is taken up when the cover plate is taken out is prevented, and the phenomenon that the supporting plate is taken up when the cover plate is added and taken out is avoided.

Description

technical field [0001] The invention relates to a cover replacement structure, in particular to a machine for loading, covering, unloading and removing the cover of a semiconductor substrate. Background technique [0002] Existing equipment only meets the function of loading and unloading, that is, the tray is pushed out from the material box and sent into the water washing machine, and the tray flowing out of the water washing machine is put back into the material box after washing. There will be many chips in the tray that needs to be washed, and the chips are placed regularly in the tray, and the degrees of freedom are restricted in the front, back, left, and bottom. Only the top of the chip is not restricted in the degree of freedom. No problem, but the chip will be washed out of the tray by the water flow when it passes through the washing machine, causing the chip to be scrapped and increasing the processing cost of the chip. Contents of the invention [0003] In or...

Claims

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Application Information

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IPC IPC(8): B65G47/52B65G47/90
CPCB65G47/52B65G47/90
Inventor 林海涛赵凯梁猛姚玉鹏程坤喜
Owner 上海世禹精密机械有限公司
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