The invention discloses a machine for feeding, cover adding, discharging and cover removing of a semiconductor substrate. The machine comprises a feeding part, a washing machine and a discharging part, wherein the front part and the rear part of the washing machine are connected with the feeding part and the discharging part respectively; and the feeding part comprises a material box feeding conveying belt, a material box clamping jaw, a push rod, a supporting plate positioning rail, a cover plate feeding area, a cover plate adsorption area and a first material distribution guide rail, and the discharging part comprises a washing flow channel, a second material distribution guide rail, a positioning guide rail, a cover plate discharging area, a material box discharging area, a cover plate adsorption mechanism, a push rod part and a material box clamping part. On the basis of a common feeding machine, the function of additionally arranging a cover plate on a supporting plate is added, the function of preventing the situation of chips from being flushed out of the supporting plate by water flow and causing chip scrapping is achieved, and the supporting plate is positioned on the guide rails, so that the situation that the when the supporting plate deforms, the supporting plate is taken up when the cover plate is taken out is prevented, and the phenomenon that the supporting plate is taken up when the cover plate is added and taken out is avoided.