Unlock instant, AI-driven research and patent intelligence for your innovation.

A method and system for testing internal interconnection interfaces of a multi-board system

A technology for internal interconnection and interface testing, applied in fault hardware testing methods, electrical connection testing, transmission systems, etc., can solve cumbersome problems, reduce cumbersomeness and improve test efficiency.

Active Publication Date: 2021-12-03
湖南博匠信息科技有限公司
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main purpose of the present invention is to provide a method and system for testing the internal interconnection interface of a multi-board system. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method and system for testing internal interconnection interfaces of a multi-board system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0059] The invention provides a method and system for testing the internal interconnection interface of a multi-board system.

[0060] as attached figure 1 As shown, in the first embodiment of a multi-board system internal interconnection interface testing method proposed by the present invention, this embodiment is applied to a multi-board system internal interconnection interface test system; the system includes a standard board, a chassis and an upper computer; the chassis includes a main control board and a backplane; the main control board is communicatively connected to the backplane; the upper computer is communicatively connected to the backplane; at least 2 slots are provided on the backplane (preferably 4 in this embodiment); each of the slots is used to set the standard boards respectively, and in this emb...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and system for testing the internal interconnection interface of a multi-board card system. The method is applied to a multi-board card system internal interconnection interface testing system; the system includes a standard board card, a chassis and a host computer; the chassis includes A main control board and a backplane; the main control board is communicatively connected to the backplane; the upper computer is communicatively connected to the backplane; the backplane is provided with at least two slots; When the chassis is tested, it is only necessary to use standard boards compatible with various common types of communication signals, that is, to complete the test of various types of communication signals on the chassis; it is no longer necessary to test each type of communication signal in the traditional test method. Use different test boards to test the chassis; in this way, the complexity of the communication test on the chassis can be reduced and the test efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of board card testing, in particular to a method and system for testing internal interconnection interfaces of a multi-board card system. Background technique [0002] At present, standardized chassis (such as 3U chassis) in the field of embedded devices are more and more widely used. The power supply board, main control board and backplane are preset in the chassis; in actual use, plug different functional boards into Connected to the backplane to realize different application functions. [0003] In practical applications, communication signals will be interacted between each functional board and between the functional board and the main control board, and these communication signals will also interact with the external environment through the backplane. [0004] In order to ensure the smooth flow of each communication signal in the chassis, it is necessary to test all types of communication signals. The s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04L12/26H04L12/40G01R31/68G01R1/04G06F11/22
CPCG01R1/0416G06F11/2221G06F11/2273G01R31/68H04L12/40H04L43/08H04L2012/40215H04L2012/40234H04L2012/40241
Inventor 叶惠陈月玲
Owner 湖南博匠信息科技有限公司