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circuit board

A circuit board and circuit technology, applied in the directions of printed circuit components, circuit inspection/identification, etc., can solve problems such as abnormal scratches on circuit boards, abnormal test results, and test probe offsets.

Active Publication Date: 2022-05-06
CHIPBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the test probes of the probe card are aligned by manual visual inspection, when the operator is different or the circuit design on the circuit board is different, the test probes will be offset, resulting in abnormal test results, or making the circuit There are abnormal scratches on the circuit on the board

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0047] see figure 1 , the first embodiment of the present invention, a circuit board 100 is used to be conveyed along the first axis direction Y, the circuit board 100 includes a carrier 110 patterned metal layer 120, a solder resist layer 130 and a first mark 140, the The carrier 110 has a surface 111. Along the first axis direction Y, the surface 111 includes a chip installation area 111a and a circuit installation area 111b. In this embodiment, the surface 111 further includes a transmission hole installation area 111f. The area 111f is located outside the solder resist layer 130. Along the direction of the first axis Y, a plurality of transmission holes 111g are arranged at intervals in the transmission hole setting area 111f. The patterned metal layer 120 is disposed on the surface 111. The patterned metal layer 111g The layer 120 has a plurality of lines 121, and the lines 121 respectively include a first line section 121a, a second line section 121b and a third line sec...

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PUM

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Abstract

A circuit board includes a carrier, a patterned metal layer, a solder resist layer and a mark, the patterned metal layer is arranged on the surface of the carrier, the patterned metal layer has a plurality of circuits, and the solder resist layer covers each of the circuits and exposes Each line section of the line is drawn, and the line section passes through the test probe action path area of ​​the carrier, and the test probe action path area is used to define the moving track of the test probe card, so that the test probe in the movement The test probes of the card sequentially contact the line segments located on the test probe action path area, and the mark has an identification boundary, and the identification boundary is used to view the test probe action path area to avoid the test in motion. The probe card is offset from the test probe action path area.

Description

technical field [0001] The invention relates to a circuit board, in particular to a circuit board which can be contacted and detected by test probes. Background technique [0002] The electrical connection between electronic components usually depends on the circuit board. However, when the circuit board is manufactured, if the circuit on the circuit board is disconnected or short-circuited, the electronic components will not be electrically connected. Alignment is performed manually so that at least one test probe of the probe card (Probe Card) touches the circuit on the circuit board, so as to conduct an electrical test on the circuit on the circuit board. [0003] Since the test probes of the probe card are aligned by manual visual inspection, when the operator is different or the circuit design on the circuit board is different, the test probes will be offset, resulting in abnormal test results, or making the circuit There are abnormal scratches on the wiring on the boa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0268H05K1/02
Inventor 魏兆璟许维哲吴姿悯
Owner CHIPBOND TECH