Chip packaging structure and manufacturing method thereof
A technology of chip packaging structure and packaging body, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., and can solve the problem of unstable center of gravity of step structure, difficulty in design, increase of lateral size of chip packaging structure, etc. problem, to achieve the effect of convenient graphic setting, small overall size and accurate electrical connection
Active Publication Date: 2021-09-03
YANGTZE MEMORY TECH CO LTD
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- Application Information
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Problems solved by technology
[0004] In the process of stacking dies, if the steps are extended in one direction, the lateral size of the chip package structure will increase and the center of gravity of the step structure will be unstable.
In addition, as the number of dies in the package structure increases, the number of contacts that need to be placed in the rewiring layer also increases, making it more difficult to design
Method used
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[0029] For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are descriptions of exemplary embodiments of the application only, and are not intended to limit the scope of the application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.
[0030] It should be noted that in this specification, expressions of first, second, third, etc. are only used to distinguish one feature from another, and do not represent any limitation on the features. Accordingly, a first fold discussed hereinafter may also be referred to as a second fold without departing from the teachings of the present application. vice versa.
[0031] In the drawings, the thickness, size and shape of comp...
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The invention provides a chip packaging structure and a manufacturing method thereof. The chip packaging structure comprises a step structure, wherein the step structure comprises a plurality of tube cores stacked in the vertical direction and metal line segments, first ends of the metal line segments are fixedly and electrically connected with bonding pads of the tube cores, the metal line segments comprise bent parts which are close to the first ends and have a bent form, the protruding side of the bending part is far away from the tube core in the direction parallel to the bonding pad; and the packaging body is used for packaging the step structure and the metal line segment, and a second end of the metal line segment is exposed on an upper surface of the packaging body.
Description
technical field [0001] The present application relates to the field of semiconductors, and more specifically, to a chip packaging structure and a manufacturing method thereof. Background technique [0002] When manufacturing products such as 3D NAND SSD (Three-Dimensional NAND Solid State Drive), dies are usually packaged into a chip package structure. [0003] When manufacturing a chip package structure, usually a plurality of dies are stacked to improve the integration degree of the chip package structure. The dies may be stacked in a stepped structure to avoid dies from a previous layer covering pads of dies in a lower layer. Then, metal wires need to be provided through a wire bonding process, and the metal wires are used to connect the pads of the die and the redistribution layer (RDL). [0004] In the process of stacking dies, if the steps are extended toward one direction, the lateral dimension of the chip package structure will be increased and the center of gravit...
Claims
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IPC IPC(8): H01L23/49H01L23/482H01L23/485H01L21/56H01L21/60H01L25/065
CPCH01L24/48H01L24/49H01L23/4824H01L23/485H01L24/03H01L24/85H01L21/56H01L25/0657H01L2224/4805H01L2224/4811H01L2224/0231H01L2224/02331H01L2224/02333H01L2224/02381H01L2224/49051
Inventor 钱卫松陈鹏周厚德苗健
Owner YANGTZE MEMORY TECH CO LTD