A method for manufacturing automatic screen-printed SMD LEDs

Abstract

The invention relates to a manufacturing method of an automatic silk-screen paster LED (light emitting diode). The method comprises the steps of pasting films on welding surfaces of disks of multiple semiconductor lighting eutectic wafers; performing laser cutting to obtain multiple semiconductor lighting eutectic wafers pasted to the films; pasting the lighting surfaces of the semiconductor lighting eutectic wafers to an expansion film; removing the films on the welding surfaces of the semiconductor lighting eutectic wafers; performing wafer expansion operation on the expansion film with automatic silk-screen LED paster equipment to enable the semiconductor lighting eutectic wafers to correspond to loading empty positions of wafer carriers; spot-coating anisotropic conductive silver adhesive to the loading positions of the LED wafer carriers; step-moving the expansion film to implant the expanded semiconductor lighting eutectic wafers to the corresponding loading empty positions on the wafer carriers; rolling a roller shaft of the automatic silk-screen LED paster equipment on the back of the expansion film for a certain time in a reciprocation mode, and curing and electrically connecting the semiconductor lighting eutectic wafers and the wafer carriers.

Description

Technical field [0001] The present invention relates to the field of semiconductors, and in particular to an automatic silk-screen patch LED manufacturing method based on Direct Attach (DA) semiconductor light-emitting eutectic wafers. Background technique [0002] In the development of traditional semiconductor display products to this day, supporting or cross-industry resources have been greatly enriched and improved. In the traditional manufacturing process of semiconductor display products, conventional surface mount technology (SMT) or plug-in process is usually used. Taking SMT as an example, it needs to go through the preparation of semiconductor wafer carrier, preparation of die bonding equipment, and auxiliary material gold wire Preparation of silver glue, preparation of die wafer and expansion equipment, preparation of wire bonding equipment, etc. [0003] The above-mentioned traditional manufacturing method has many processes and the stability and detection of each proc...

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Problems solved by technology

[0003] The above-mentioned traditional manufacturing method has a lot of processes and the stabilization and detection of each process is very cumbersome, the manufacturing process takes a long time, and when the resolution of the semiconductor display is increased to a certain level (for example, when the pixel pitch is required to be less than 1MM), the processing cannot be realized.

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