Printed circuit board support assembly

A technology for wiring circuit substrates and components, which is applied in the field of supporting components for wiring circuit substrates, can solve the problems of complicated cutting of connecting parts, etc., and achieve the effect of suppressing peeling

Pending Publication Date: 2021-09-03
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the cutting of the connection portion between the

Method used

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  • Printed circuit board support assembly
  • Printed circuit board support assembly
  • Printed circuit board support assembly

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Refer Figure 1 ~ 6 The assembly sheet 1 of one embodiment of a wiring circuit board support assembly as the present invention is clear.

[0039] like figure 1 As shown, the assembly piece 1 includes a plurality of tape circuit of a plurality of tape circuits as an example of a wiring circuit board, a plurality of connecting portions, a plurality of first reinforcing portions 5, a plurality of second connecting portions 6 And a plurality of second reinforcing portions 7. In addition, figure 1 In order to facilitate convenience, the suspension substrate 2 of the plurality of circuits is three, but the number of suspension substrate 2 with circuitry is not particularly limited.

[0040] 1. Suspension substrate with circuit

[0041] The suspension substrate 2 with circuitry has a substantially flat shape extending in a predetermined direction.

[0042] exist figure 1 In the thickness direction of the paper surface, the thickness direction (first direction) of the suspension sub...

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PUM

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Abstract

The invention provides a printed circuit board support assembly. An aggregate sheet (1) is provided with: a suspension board (2) having a circuit; a frame body (3) for supporting the suspension board (2) with the circuit; and a connection part (4) which is formed of a resin material and connects the suspension board with the circuit and the frame body. A suspension board with a circuit is provided with a first metal support layer (20), a base insulating layer (21), and a conductor layer (22). The frame body is formed by a second metal support layer (50) disposed at a distance from the first metal support layer (20). The connection part (4) includes: a first portion (55A) disposed on the first metal support layer (20) and extending in the width direction; a second portion (55B) disposed on the second metal support layer (50) and extending in the width direction; and a first connecting portion (55C) that connects a part of the first portion in the width direction and a part of the second portion in the width direction.

Description

technical field [0001] The present invention relates to a wiring circuit substrate supporting assembly. Background technique [0002] Wiring circuit boards are used in various industrial products such as electronic and electric equipment. As such wired circuit boards, for example, a flexible printed circuit board with a reinforcement layer including a metal support layer as a reinforcement layer, a suspension board with circuit including a metal support layer as a suspension (spring) layer, and the like are known. [0003] In the manufacturing process of such a wired circuit board, first, a wired circuit board supporting unit in which the wired circuit board is supported by a frame is prepared, and then the wired circuit board is cut off from the wired circuit board supporting unit. In such a wired circuit board supporting assembly, generally, the frame body is made of the same metal as the metal supporting layer of the wired circuit board, and the frame body and the metal ...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/007
Inventor 东誉人藤村仁人
Owner NITTO DENKO CORP
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