Method and device for improving temperature measurement precision

A temperature measurement and accuracy technology, applied in the field of improving temperature measurement accuracy, can solve the problems of data deviation, prone to temperature loss, increase wafer process damage rate, etc., to achieve zero temperature loss and improve temperature measurement accuracy.

Active Publication Date: 2021-09-07
WUXI YUBANG SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a method and device for improving the accuracy of temperature measurement, which solves the technical problem that temperature loss is prone to occur during temperature measurement in the prior art, which makes the detected data deviate and increases the damage rate of the wafer process. Achieved the technical effect of converting the measured data by adding a conversion module and a temperature comparison module to achieve zero temperature loss, improve the accuracy of temperature measurement, and complete timely warnings for abnormal information

Method used

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  • Method and device for improving temperature measurement precision
  • Method and device for improving temperature measurement precision
  • Method and device for improving temperature measurement precision

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Embodiment 1

[0025] Such as figure 1 As shown, the embodiment of the present application provides a method for improving the accuracy of temperature measurement, wherein the method is applied to a device for improving the accuracy of temperature measurement, and the device is connected in communication with the first temperature sensor and the second temperature sensor, Such as figure 2 As shown, the method completes corresponding control based on the temperature comparison device structure, wherein the temperature comparison device structure includes a first temperature sensor 1, a first conversion module 2, a circuit board 3, a machine main system 4, and a second temperature sensor 5, the second conversion module 6, the temperature display meter head 7, and the real-time comparison module 8, the method includes:

[0026] Step S100: Detecting the first temperature control component according to the first temperature sensor to obtain a first analog signal;

[0027] Specifically, a tempe...

Embodiment S735

[0064] Further, the embodiment S735 of the present application also includes:

[0065] Step S7351: Obtain the first warning frequency in the first preset time period;

[0066] Step S7352: judging whether the first warning frequency is within the preset warning frequency threshold;

[0067] Step S7353: If the first warning frequency is not in the preset warning frequency, obtain a first collection instruction;

[0068] Step S7354: Analyze all early warning information according to the first collection instruction to obtain the first main influencing component;

[0069] Step S7355: Replace the first main influencing component according to the first replacement instruction.

[0070] Specifically, the first early warning frequency is the frequency of early warning when all the early warning information in the preset time is collected. Further, it is judged whether the frequency of the early warning is too abnormal or too frequent through the preset frequency early warning, and t...

Embodiment 2

[0081] Based on the same inventive idea as a method for improving temperature measurement accuracy in the foregoing embodiments, the present invention also provides a device for improving temperature measurement accuracy, such as image 3 As shown, the device includes:

[0082] A first obtaining unit 11, the first obtaining unit 11 is configured to detect the first temperature control component according to the first temperature sensor, and obtain a first analog signal;

[0083] A first conversion unit 12, configured to input the first analog signal into a first conversion module to obtain a first digital signal;

[0084] A second obtaining unit 13, the second obtaining unit 13 is configured to detect the first temperature control component according to the second temperature sensor, and obtain a second analog signal;

[0085] A second conversion unit 14, configured to input the second analog signal into a second conversion module to obtain a second digital signal;

[0086] ...

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Abstract

The invention discloses a method and device for improving temperature measurement precision. The method comprises the steps of detecting a first temperature control part according to a first temperature sensor and a second temperature sensor, and obtaining a first analog signal and a second analog signal; respectively inputting the first analog signal and the second analog signal into a first conversion module and a second conversion module to obtain a first digital signal and a second digital signal; inputting the first digital signal and the second digital signal into a first temperature comparison model; judging whether the first temperature control part is abnormal or not according to the obtained first comparison information; and if the first temperature control part is abnormal, inputting the multi-attribute information of the first temperature control part into a temperature change prediction model to obtain first prediction information, and then obtaining first early warning information. The technical problems that in the prior art, temperature loss is prone to occurring during temperature measurement, so that detected data deviates, and the wafer process damage rate is increased are solved.

Description

technical field [0001] The invention relates to the related field of semiconductor dry etching equipment, in particular to a method and device for improving temperature measurement accuracy. Background technique [0002] Dry etching equipment has many heating and cooling components. These components have relatively high temperature requirements. Originally, there was only one temperature detection system. If one of the temperature control components fails, the main system of the machine cannot monitor the accurate temperature. When the temperature deviates, it will have an impact on the wafer process. Make the wafer scrapped. Different processes require different component temperatures, and the component temperature is controlled through the process menu. In order to realize real-time monitoring of different temperatures, it is necessary to further accurately measure the component temperature. [0003] However, in the process of realizing the technical solution of the inve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/02G01K7/16G01K1/022G01K1/14G06N3/08
CPCG01K7/02G01K7/16G01K1/022G01K1/14G06N3/08
Inventor 方亮
Owner WUXI YUBANG SEMICON TECH CO LTD
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